@oriro/orirocli 0.1.9 → 0.1.11

package/skills/engineering/eng-electronics-embedded/SKILL.md

@@ -1,89 +1,89 @@
----
-watermark: ORIRO
-disable-model-invocation: true
-name: eng-electronics-embedded
-provider: ORIRO.ai
-copyright: Copyright (c) 2026 ORIRO.ai
-description: >
-  Electronics and embedded systems — microcontrollers, Arduino, Raspberry Pi,
-  GPIO, ADC, serial protocols (UART, I2C, SPI), sensors, motor control, and
-  3D printer firmware. Sources: Arduino docs (CC-BY-SA), Raspberry Pi Foundation (CC-BY).
----
-
-# Electronics and Embedded Systems
-
-## Microcontrollers
-
-**Arduino (AVR/ARM):** Most beginner-friendly. C/C++ with abstracted hardware.
-**STM32 (ARM Cortex-M):** Industrial-grade. More peripherals.
-**ESP32:** WiFi + Bluetooth + dual-core ARM. For IoT.
-**Raspberry Pi Pico:** RP2040 chip. MicroPython supported.
-
-## GPIO (General Purpose Input/Output)
-
-Digital I/O: Logic HIGH (3.3V or 5V) or LOW (0V).
-Current limits: Arduino: 40mA per pin max. Don't drive motors directly.
-
-```cpp
-void setup() {
-    pinMode(LED_BUILTIN, OUTPUT);
-    pinMode(2, INPUT_PULLUP);
-}
-void loop() {
-    if (digitalRead(2) == LOW) {
-        digitalWrite(LED_BUILTIN, HIGH);
-    } else {
-        digitalWrite(LED_BUILTIN, LOW);
-    }
-}
-```
-
-## ADC (Analog to Digital Converter)
-
-Arduino Uno: 10-bit ADC → 0-1023 for 0-5V. Resolution = 4.88mV/step.
-
-```cpp
-int sensorValue = analogRead(A0);
-float voltage = sensorValue * (5.0/1023.0);
-```
-
-## Serial protocols
-
-### UART
-
-Two wires: TX and RX. Cross-connect.
-
-```cpp
-Serial.begin(115200);
-Serial.println("Hello ORIRO");
-```
-
-### I2C
-
-Two wires: SDA, SCL. Pull-up resistors (4.7kΩ). Up to 127 devices.
-
-### SPI
-
-Four wires: MOSI, MISO, SCLK, CS. Faster than I2C. Full duplex.
-
-## Sensors
-
-**Temperature:** DS18B20 (1-Wire, ±0.5°C), BME280 (I2C).
-**IMU:** MPU-6050 (accel+gyro), BNO055 (absolute orientation).
-**Distance:** HC-SR04 (ultrasonic, 2-400cm), VL53L0X (laser ToF).
-
-## Motor control
-
-**DC motors:** L298N or DRV8833 driver. PWM to control speed.
-**Stepper motors:** A4988 driver. NEMA 17 for 3D printers.
-**Servo motors:** PWM 50Hz, 1ms-2ms pulse = 0°-180°.
-
-```cpp
-#include <Servo.h>
-Servo myservo;
-myservo.attach(9);
-myservo.write(90);
-```
-
-Sources: Arduino documentation (CC-BY-SA), Raspberry Pi Foundation (CC-BY),
-Adafruit tutorials (CC-BY-SA)
+---
+watermark: ORIRO
+disable-model-invocation: true
+name: eng-electronics-embedded
+provider: ORIRO.ai
+copyright: Copyright (c) 2026 ORIRO.ai
+description: >
+  Electronics and embedded systems — microcontrollers, Arduino, Raspberry Pi,
+  GPIO, ADC, serial protocols (UART, I2C, SPI), sensors, motor control, and
+  3D printer firmware. Sources: Arduino docs (CC-BY-SA), Raspberry Pi Foundation (CC-BY).
+---
+
+# Electronics and Embedded Systems
+
+## Microcontrollers
+
+**Arduino (AVR/ARM):** Most beginner-friendly. C/C++ with abstracted hardware.
+**STM32 (ARM Cortex-M):** Industrial-grade. More peripherals.
+**ESP32:** WiFi + Bluetooth + dual-core ARM. For IoT.
+**Raspberry Pi Pico:** RP2040 chip. MicroPython supported.
+
+## GPIO (General Purpose Input/Output)
+
+Digital I/O: Logic HIGH (3.3V or 5V) or LOW (0V).
+Current limits: Arduino: 40mA per pin max. Don't drive motors directly.
+
+```cpp
+void setup() {
+    pinMode(LED_BUILTIN, OUTPUT);
+    pinMode(2, INPUT_PULLUP);
+}
+void loop() {
+    if (digitalRead(2) == LOW) {
+        digitalWrite(LED_BUILTIN, HIGH);
+    } else {
+        digitalWrite(LED_BUILTIN, LOW);
+    }
+}
+```
+
+## ADC (Analog to Digital Converter)
+
+Arduino Uno: 10-bit ADC → 0-1023 for 0-5V. Resolution = 4.88mV/step.
+
+```cpp
+int sensorValue = analogRead(A0);
+float voltage = sensorValue * (5.0/1023.0);
+```
+
+## Serial protocols
+
+### UART
+
+Two wires: TX and RX. Cross-connect.
+
+```cpp
+Serial.begin(115200);
+Serial.println("Hello ORIRO");
+```
+
+### I2C
+
+Two wires: SDA, SCL. Pull-up resistors (4.7kΩ). Up to 127 devices.
+
+### SPI
+
+Four wires: MOSI, MISO, SCLK, CS. Faster than I2C. Full duplex.
+
+## Sensors
+
+**Temperature:** DS18B20 (1-Wire, ±0.5°C), BME280 (I2C).
+**IMU:** MPU-6050 (accel+gyro), BNO055 (absolute orientation).
+**Distance:** HC-SR04 (ultrasonic, 2-400cm), VL53L0X (laser ToF).
+
+## Motor control
+
+**DC motors:** L298N or DRV8833 driver. PWM to control speed.
+**Stepper motors:** A4988 driver. NEMA 17 for 3D printers.
+**Servo motors:** PWM 50Hz, 1ms-2ms pulse = 0°-180°.
+
+```cpp
+#include <Servo.h>
+Servo myservo;
+myservo.attach(9);
+myservo.write(90);
+```
+
+Sources: Arduino documentation (CC-BY-SA), Raspberry Pi Foundation (CC-BY),
+Adafruit tutorials (CC-BY-SA)

package/skills/engineering/eng-environmental/LICENSE

@@ -1,21 +1,21 @@
-MIT License
-
-Copyright (c) 2026 ORIRO.ai
-
-Permission is hereby granted, free of charge, to any person obtaining a copy
-of this software and associated documentation files (the "Software"), to deal
-in the Software without restriction, including without limitation the rights
-to use, copy, modify, merge, publish, distribute, sublicense, and/or sell
-copies of the Software, and to permit persons to whom the Software is
-furnished to do so, subject to the following conditions:
-
-The above copyright notice and this permission notice shall be included in all
-copies or substantial portions of the Software.
-
-THE SOFTWARE IS PROVIDED "AS IS", WITHOUT WARRANTY OF ANY KIND, EXPRESS OR
-IMPLIED, INCLUDING BUT NOT LIMITED TO THE WARRANTIES OF MERCHANTABILITY,
-FITNESS FOR A PARTICULAR PURPOSE AND NONINFRINGEMENT. IN NO EVENT SHALL THE
-AUTHORS OR COPYRIGHT HOLDERS BE LIABLE FOR ANY CLAIM, DAMAGES OR OTHER
-LIABILITY, WHETHER IN AN ACTION OF CONTRACT, TORT OR OTHERWISE, ARISING FROM,
-OUT OF OR IN CONNECTION WITH THE SOFTWARE OR THE USE OR OTHER DEALINGS IN THE
-SOFTWARE.
+MIT License
+
+Copyright (c) 2026 ORIRO.ai
+
+Permission is hereby granted, free of charge, to any person obtaining a copy
+of this software and associated documentation files (the "Software"), to deal
+in the Software without restriction, including without limitation the rights
+to use, copy, modify, merge, publish, distribute, sublicense, and/or sell
+copies of the Software, and to permit persons to whom the Software is
+furnished to do so, subject to the following conditions:
+
+The above copyright notice and this permission notice shall be included in all
+copies or substantial portions of the Software.
+
+THE SOFTWARE IS PROVIDED "AS IS", WITHOUT WARRANTY OF ANY KIND, EXPRESS OR
+IMPLIED, INCLUDING BUT NOT LIMITED TO THE WARRANTIES OF MERCHANTABILITY,
+FITNESS FOR A PARTICULAR PURPOSE AND NONINFRINGEMENT. IN NO EVENT SHALL THE
+AUTHORS OR COPYRIGHT HOLDERS BE LIABLE FOR ANY CLAIM, DAMAGES OR OTHER
+LIABILITY, WHETHER IN AN ACTION OF CONTRACT, TORT OR OTHERWISE, ARISING FROM,
+OUT OF OR IN CONNECTION WITH THE SOFTWARE OR THE USE OR OTHER DEALINGS IN THE
+SOFTWARE.

package/skills/engineering/eng-environmental/SKILL.md

@@ -1,66 +1,66 @@
----
-watermark: ORIRO
-disable-model-invocation: true
-name: eng-environmental
-provider: ORIRO.ai
-copyright: Copyright (c) 2026 ORIRO.ai
-description: >
-
-
-
-  Environmental engineering — water treatment, air quality, waste management, contamination remediation, and environmental regulations.
-
-
-
-  Sources: MIT OCW, ASME principles, OSHA, engineering textbook fundamentals.
-  Consult a licensed professional engineer for safety-critical calculations.
----
-
-# Environmental Engineering
-
-## Water treatment (drinking water)
-
-**Conventional treatment train:**
-
-1. Coagulation/Flocculation: Add alum or ferric chloride. Destabilizes colloids. Gentle mixing forms flocs.
-2. Sedimentation: Flocs settle. Gravity clarification.
-3. Filtration: Sand/anthracite filters remove remaining particles. Target < 0.1 NTU turbidity.
-4. Disinfection: Chlorine (most common), UV, ozone.
-   **EPA MCLs (Maximum Contaminant Levels):** Legally enforceable limits. Turbidity < 1 NTU (treated), Nitrate < 10 mg/L, Lead < 15 µg/L action level.
-
-## Wastewater treatment
-
-**Primary:** Physical separation. Screening, grit removal, primary clarifiers. Removes ~60% TSS, 30% BOD.
-**Secondary:** Biological treatment. Activated sludge (most common) uses microorganisms to consume organic matter. Removes >90% BOD and TSS.
-**Tertiary/Advanced:** Nutrient removal (nitrogen, phosphorus), filtration, disinfection, reuse.
-**BOD (Biochemical Oxygen Demand):** Measure of organic pollution. BOD₅ = oxygen consumed in 5 days at 20°C.
-
-## Air quality
-
-**Criteria pollutants (EPA NAAQS):** PM2.5, PM10, O₃, NO₂, SO₂, CO, Pb.
-**PM2.5:** Particles < 2.5 µm. Most health-damaging. Annual standard: 12 µg/m³.
-**Ground-level ozone:** Formed from NOx + VOCs + sunlight. NAAQS: 70 ppb 8-hour.
-**Control technologies:**
-Baghouse filters: 99%+ collection efficiency for particles.
-Electrostatic precipitators: High efficiency for fine particles.
-SCR (Selective Catalytic Reduction): NOx control for combustion sources.
-Scrubbers: SO₂ removal using limestone slurry.
-
-## Contaminated site assessment
-
-**Phase I ESA:** Records review, site inspection, interviews. No sampling. Identifies RECs (Recognized Environmental Conditions).
-**Phase II ESA:** Sampling and analysis. Confirms/characterizes contamination.
-**Remediation technologies:**
-Pump and treat: Extract contaminated groundwater, treat aboveground. Slow but established.
-In-situ chemical oxidation (ISCO): Inject oxidants (permanganate, persulfate) to destroy contaminants.
-Bioremediation: Enhance microbial degradation of contaminants.
-SVE (Soil Vapor Extraction): Vacuum system extracts volatile compounds from vadose zone.
-
-## Hazardous waste (RCRA)
-
-Generator requirements: Proper labeling, storage time limits, manifests for transport.
-Characteristic hazardous wastes: Ignitability (flash point < 60°C), corrosivity (pH < 2 or > 12.5), reactivity, toxicity (TCLP test).
-Universal wastes: Batteries, fluorescent lamps, pesticides — simplified management.
-
-Sources: EPA environmental regulations (epa.gov), Davis & Masten Introduction to Environmental Engineering (principles),
-AWWA water treatment manuals, ASCE Environmental Engineering principles
+---
+watermark: ORIRO
+disable-model-invocation: true
+name: eng-environmental
+provider: ORIRO.ai
+copyright: Copyright (c) 2026 ORIRO.ai
+description: >
+
+
+
+  Environmental engineering — water treatment, air quality, waste management, contamination remediation, and environmental regulations.
+
+
+
+  Sources: MIT OCW, ASME principles, OSHA, engineering textbook fundamentals.
+  Consult a licensed professional engineer for safety-critical calculations.
+---
+
+# Environmental Engineering
+
+## Water treatment (drinking water)
+
+**Conventional treatment train:**
+
+1. Coagulation/Flocculation: Add alum or ferric chloride. Destabilizes colloids. Gentle mixing forms flocs.
+2. Sedimentation: Flocs settle. Gravity clarification.
+3. Filtration: Sand/anthracite filters remove remaining particles. Target < 0.1 NTU turbidity.
+4. Disinfection: Chlorine (most common), UV, ozone.
+   **EPA MCLs (Maximum Contaminant Levels):** Legally enforceable limits. Turbidity < 1 NTU (treated), Nitrate < 10 mg/L, Lead < 15 µg/L action level.
+
+## Wastewater treatment
+
+**Primary:** Physical separation. Screening, grit removal, primary clarifiers. Removes ~60% TSS, 30% BOD.
+**Secondary:** Biological treatment. Activated sludge (most common) uses microorganisms to consume organic matter. Removes >90% BOD and TSS.
+**Tertiary/Advanced:** Nutrient removal (nitrogen, phosphorus), filtration, disinfection, reuse.
+**BOD (Biochemical Oxygen Demand):** Measure of organic pollution. BOD₅ = oxygen consumed in 5 days at 20°C.
+
+## Air quality
+
+**Criteria pollutants (EPA NAAQS):** PM2.5, PM10, O₃, NO₂, SO₂, CO, Pb.
+**PM2.5:** Particles < 2.5 µm. Most health-damaging. Annual standard: 12 µg/m³.
+**Ground-level ozone:** Formed from NOx + VOCs + sunlight. NAAQS: 70 ppb 8-hour.
+**Control technologies:**
+Baghouse filters: 99%+ collection efficiency for particles.
+Electrostatic precipitators: High efficiency for fine particles.
+SCR (Selective Catalytic Reduction): NOx control for combustion sources.
+Scrubbers: SO₂ removal using limestone slurry.
+
+## Contaminated site assessment
+
+**Phase I ESA:** Records review, site inspection, interviews. No sampling. Identifies RECs (Recognized Environmental Conditions).
+**Phase II ESA:** Sampling and analysis. Confirms/characterizes contamination.
+**Remediation technologies:**
+Pump and treat: Extract contaminated groundwater, treat aboveground. Slow but established.
+In-situ chemical oxidation (ISCO): Inject oxidants (permanganate, persulfate) to destroy contaminants.
+Bioremediation: Enhance microbial degradation of contaminants.
+SVE (Soil Vapor Extraction): Vacuum system extracts volatile compounds from vadose zone.
+
+## Hazardous waste (RCRA)
+
+Generator requirements: Proper labeling, storage time limits, manifests for transport.
+Characteristic hazardous wastes: Ignitability (flash point < 60°C), corrosivity (pH < 2 or > 12.5), reactivity, toxicity (TCLP test).
+Universal wastes: Batteries, fluorescent lamps, pesticides — simplified management.
+
+Sources: EPA environmental regulations (epa.gov), Davis & Masten Introduction to Environmental Engineering (principles),
+AWWA water treatment manuals, ASCE Environmental Engineering principles

package/skills/engineering/eng-manufacturing/LICENSE

@@ -1,21 +1,21 @@
-MIT License
-
-Copyright (c) 2026 ORIRO.ai
-
-Permission is hereby granted, free of charge, to any person obtaining a copy
-of this software and associated documentation files (the "Software"), to deal
-in the Software without restriction, including without limitation the rights
-to use, copy, modify, merge, publish, distribute, sublicense, and/or sell
-copies of the Software, and to permit persons to whom the Software is
-furnished to do so, subject to the following conditions:
-
-The above copyright notice and this permission notice shall be included in all
-copies or substantial portions of the Software.
-
-THE SOFTWARE IS PROVIDED "AS IS", WITHOUT WARRANTY OF ANY KIND, EXPRESS OR
-IMPLIED, INCLUDING BUT NOT LIMITED TO THE WARRANTIES OF MERCHANTABILITY,
-FITNESS FOR A PARTICULAR PURPOSE AND NONINFRINGEMENT. IN NO EVENT SHALL THE
-AUTHORS OR COPYRIGHT HOLDERS BE LIABLE FOR ANY CLAIM, DAMAGES OR OTHER
-LIABILITY, WHETHER IN AN ACTION OF CONTRACT, TORT OR OTHERWISE, ARISING FROM,
-OUT OF OR IN CONNECTION WITH THE SOFTWARE OR THE USE OR OTHER DEALINGS IN THE
-SOFTWARE.
+MIT License
+
+Copyright (c) 2026 ORIRO.ai
+
+Permission is hereby granted, free of charge, to any person obtaining a copy
+of this software and associated documentation files (the "Software"), to deal
+in the Software without restriction, including without limitation the rights
+to use, copy, modify, merge, publish, distribute, sublicense, and/or sell
+copies of the Software, and to permit persons to whom the Software is
+furnished to do so, subject to the following conditions:
+
+The above copyright notice and this permission notice shall be included in all
+copies or substantial portions of the Software.
+
+THE SOFTWARE IS PROVIDED "AS IS", WITHOUT WARRANTY OF ANY KIND, EXPRESS OR
+IMPLIED, INCLUDING BUT NOT LIMITED TO THE WARRANTIES OF MERCHANTABILITY,
+FITNESS FOR A PARTICULAR PURPOSE AND NONINFRINGEMENT. IN NO EVENT SHALL THE
+AUTHORS OR COPYRIGHT HOLDERS BE LIABLE FOR ANY CLAIM, DAMAGES OR OTHER
+LIABILITY, WHETHER IN AN ACTION OF CONTRACT, TORT OR OTHERWISE, ARISING FROM,
+OUT OF OR IN CONNECTION WITH THE SOFTWARE OR THE USE OR OTHER DEALINGS IN THE
+SOFTWARE.

package/skills/engineering/eng-manufacturing/SKILL.md

@@ -1,78 +1,78 @@
----
-watermark: ORIRO
-disable-model-invocation: true
-name: eng-manufacturing
-provider: ORIRO.ai
-copyright: Copyright (c) 2026 ORIRO.ai
-description: >
-
-
-
-
-  Manufacturing engineering — process planning, quality control, lean manufacturing, tolerances, production systems, and operations.
-
-
-  Sources: MIT OCW, ASME principles, OSHA, engineering textbook fundamentals.
-  Consult a licensed professional engineer for safety-critical calculations.
----
-
-# Manufacturing Engineering
-
-## Manufacturing processes
-
-### Machining (subtractive)
-
-**Turning (lathe):** Rotates workpiece against stationary cutting tool. Creates cylindrical shapes.
-**Milling:** Rotating cutter removes material from stationary workpiece. Creates flat surfaces, slots, complex shapes.
-**Drilling:** Creates holes. Twist drill most common.
-**Grinding:** Abrasive wheel removes material. Final finish operations. Tight tolerances.
-**Key parameters:** Cutting speed (surface speed), feed rate, depth of cut. Optimize for: tool life, surface finish, material removal rate.
-
-### Forming processes
-
-**Forging:** Compressive force shapes metal. Grain flow follows shape — strong parts.
-**Casting:** Molten metal poured into mold. Complex shapes. Sand casting (rough) vs. die casting (precise, high volume).
-**Stamping/sheet metal forming:** Punching, bending, drawing, roll forming.
-**Injection molding:** Plastic injected into mold under high pressure. High volume, precise.
-**Additive manufacturing (3D printing):** FDM (fused deposition modeling), SLS (laser sintering), SLA (stereolithography).
-
-## Tolerances and fits (GD&T)
-
-**Tolerance:** Allowable variation from nominal dimension.
-Unilateral: 25.00 +0.00/-0.05. Bilateral: 25.00 ±0.025.
-**Clearance fit:** Shaft always smaller than hole. For rotating or sliding parts.
-**Interference fit:** Shaft always larger than hole. Assembly requires press or heat. For permanent assemblies.
-**Transition fit:** Either clearance or interference depending on actual dimensions.
-
-## Lean manufacturing (Toyota Production System)
-
-**Seven wastes (TIMWOOD):**
-T - Transportation (unnecessary movement of material)
-I - Inventory (excess stock)
-M - Motion (unnecessary worker movement)
-W - Waiting (idle time)
-O - Overproduction (making more than needed)
-O - Over-processing (more work than required)
-D - Defects (rework and scrap)
-
-**5S methodology:** Sort, Set in order, Shine, Standardize, Sustain. Workplace organization.
-**Kanban:** Visual signal-driven pull system. Production authorized only when signal received.
-**Kaizen:** Continuous improvement. Small, incremental changes from all workers.
-**Poka-yoke:** Error-proofing. Design prevents mistakes from becoming defects.
-
-## Quality control
-
-**SPC (Statistical Process Control):** Control charts track process variation over time.
-X̄-bar chart: Monitors process mean. R-chart: Monitors range (variation).
-Control limits: Mean ± 3σ. Points outside = special cause variation requiring investigation.
-
-**Six Sigma:** Target of 3.4 defects per million opportunities.
-DMAIC: Define, Measure, Analyze, Improve, Control.
-Cpk (process capability): How well process fits within specifications. Cpk > 1.33 = capable process.
-
-**Measurement system analysis (Gauge R&R):**
-Verify measurement system before collecting data.
-% R&R < 10%: acceptable. 10-30%: marginal. >30%: unacceptable.
-
-Sources: Groover "Fundamentals of Modern Manufacturing" (principles), Toyota Production System documentation,
-Juran Quality Handbook (principles), ASME GD&T standards, ASQ quality body of knowledge
+---
+watermark: ORIRO
+disable-model-invocation: true
+name: eng-manufacturing
+provider: ORIRO.ai
+copyright: Copyright (c) 2026 ORIRO.ai
+description: >
+
+
+
+
+  Manufacturing engineering — process planning, quality control, lean manufacturing, tolerances, production systems, and operations.
+
+
+  Sources: MIT OCW, ASME principles, OSHA, engineering textbook fundamentals.
+  Consult a licensed professional engineer for safety-critical calculations.
+---
+
+# Manufacturing Engineering
+
+## Manufacturing processes
+
+### Machining (subtractive)
+
+**Turning (lathe):** Rotates workpiece against stationary cutting tool. Creates cylindrical shapes.
+**Milling:** Rotating cutter removes material from stationary workpiece. Creates flat surfaces, slots, complex shapes.
+**Drilling:** Creates holes. Twist drill most common.
+**Grinding:** Abrasive wheel removes material. Final finish operations. Tight tolerances.
+**Key parameters:** Cutting speed (surface speed), feed rate, depth of cut. Optimize for: tool life, surface finish, material removal rate.
+
+### Forming processes
+
+**Forging:** Compressive force shapes metal. Grain flow follows shape — strong parts.
+**Casting:** Molten metal poured into mold. Complex shapes. Sand casting (rough) vs. die casting (precise, high volume).
+**Stamping/sheet metal forming:** Punching, bending, drawing, roll forming.
+**Injection molding:** Plastic injected into mold under high pressure. High volume, precise.
+**Additive manufacturing (3D printing):** FDM (fused deposition modeling), SLS (laser sintering), SLA (stereolithography).
+
+## Tolerances and fits (GD&T)
+
+**Tolerance:** Allowable variation from nominal dimension.
+Unilateral: 25.00 +0.00/-0.05. Bilateral: 25.00 ±0.025.
+**Clearance fit:** Shaft always smaller than hole. For rotating or sliding parts.
+**Interference fit:** Shaft always larger than hole. Assembly requires press or heat. For permanent assemblies.
+**Transition fit:** Either clearance or interference depending on actual dimensions.
+
+## Lean manufacturing (Toyota Production System)
+
+**Seven wastes (TIMWOOD):**
+T - Transportation (unnecessary movement of material)
+I - Inventory (excess stock)
+M - Motion (unnecessary worker movement)
+W - Waiting (idle time)
+O - Overproduction (making more than needed)
+O - Over-processing (more work than required)
+D - Defects (rework and scrap)
+
+**5S methodology:** Sort, Set in order, Shine, Standardize, Sustain. Workplace organization.
+**Kanban:** Visual signal-driven pull system. Production authorized only when signal received.
+**Kaizen:** Continuous improvement. Small, incremental changes from all workers.
+**Poka-yoke:** Error-proofing. Design prevents mistakes from becoming defects.
+
+## Quality control
+
+**SPC (Statistical Process Control):** Control charts track process variation over time.
+X̄-bar chart: Monitors process mean. R-chart: Monitors range (variation).
+Control limits: Mean ± 3σ. Points outside = special cause variation requiring investigation.
+
+**Six Sigma:** Target of 3.4 defects per million opportunities.
+DMAIC: Define, Measure, Analyze, Improve, Control.
+Cpk (process capability): How well process fits within specifications. Cpk > 1.33 = capable process.
+
+**Measurement system analysis (Gauge R&R):**
+Verify measurement system before collecting data.
+% R&R < 10%: acceptable. 10-30%: marginal. >30%: unacceptable.
+
+Sources: Groover "Fundamentals of Modern Manufacturing" (principles), Toyota Production System documentation,
+Juran Quality Handbook (principles), ASME GD&T standards, ASQ quality body of knowledge

package/skills/engineering/eng-mechanical/LICENSE

@@ -1,21 +1,21 @@
-MIT License
-
-Copyright (c) 2026 ORIRO.ai
-
-Permission is hereby granted, free of charge, to any person obtaining a copy
-of this software and associated documentation files (the "Software"), to deal
-in the Software without restriction, including without limitation the rights
-to use, copy, modify, merge, publish, distribute, sublicense, and/or sell
-copies of the Software, and to permit persons to whom the Software is
-furnished to do so, subject to the following conditions:
-
-The above copyright notice and this permission notice shall be included in all
-copies or substantial portions of the Software.
-
-THE SOFTWARE IS PROVIDED "AS IS", WITHOUT WARRANTY OF ANY KIND, EXPRESS OR
-IMPLIED, INCLUDING BUT NOT LIMITED TO THE WARRANTIES OF MERCHANTABILITY,
-FITNESS FOR A PARTICULAR PURPOSE AND NONINFRINGEMENT. IN NO EVENT SHALL THE
-AUTHORS OR COPYRIGHT HOLDERS BE LIABLE FOR ANY CLAIM, DAMAGES OR OTHER
-LIABILITY, WHETHER IN AN ACTION OF CONTRACT, TORT OR OTHERWISE, ARISING FROM,
-OUT OF OR IN CONNECTION WITH THE SOFTWARE OR THE USE OR OTHER DEALINGS IN THE
-SOFTWARE.
+MIT License
+
+Copyright (c) 2026 ORIRO.ai
+
+Permission is hereby granted, free of charge, to any person obtaining a copy
+of this software and associated documentation files (the "Software"), to deal
+in the Software without restriction, including without limitation the rights
+to use, copy, modify, merge, publish, distribute, sublicense, and/or sell
+copies of the Software, and to permit persons to whom the Software is
+furnished to do so, subject to the following conditions:
+
+The above copyright notice and this permission notice shall be included in all
+copies or substantial portions of the Software.
+
+THE SOFTWARE IS PROVIDED "AS IS", WITHOUT WARRANTY OF ANY KIND, EXPRESS OR
+IMPLIED, INCLUDING BUT NOT LIMITED TO THE WARRANTIES OF MERCHANTABILITY,
+FITNESS FOR A PARTICULAR PURPOSE AND NONINFRINGEMENT. IN NO EVENT SHALL THE
+AUTHORS OR COPYRIGHT HOLDERS BE LIABLE FOR ANY CLAIM, DAMAGES OR OTHER
+LIABILITY, WHETHER IN AN ACTION OF CONTRACT, TORT OR OTHERWISE, ARISING FROM,
+OUT OF OR IN CONNECTION WITH THE SOFTWARE OR THE USE OR OTHER DEALINGS IN THE
+SOFTWARE.