@oriro/orirocli 0.1.11 → 0.3.1

package/skills/engineering/eng-cryogenics/SKILL.md

@@ -1,151 +1,151 @@
----
-watermark: ORIRO
-disable-model-invocation: true
-name: eng-cryogenics
-provider: ORIRO.ai
-copyright: Copyright (c) 2026 ORIRO.ai
-description: >
-  Cryogenic engineering — low-temperature physics, cryogenic fluids (LOX, LH2,
-  LNG, LN2), storage systems, insulation, safety, and transfer operations.
-  Activate for cryogenic fuel handling, storage design, insulation selection,
-  or any low-temperature engineering question.
-  Sources: NIST Cryogenics (free), NASA cryogenic guidelines (public domain).
----
-
-# Cryogenic Engineering
-
-## What cryogenics covers
-
-Cryogenics: Engineering below −150°C (123 K).
-Critical to: Rocket propellants, MRI magnets, liquefied natural gas (LNG), particle accelerators, quantum computers.
-
-## Key cryogenic fluids
-
-| Fluid                 | Boiling point (atm) | Density (liquid) | Notes                                                                   |
-| --------------------- | ------------------- | ---------------- | ----------------------------------------------------------------------- |
-| Liquid nitrogen (LN2) | −196°C / 77 K       | 808 kg/m³        | Inert, cheap, widely used for cooling                                   |
-| Liquid oxygen (LOX)   | −183°C / 90 K       | 1,141 kg/m³      | Rocket oxidizer, strong oxidizer, supports combustion                   |
-| Liquid hydrogen (LH2) | −253°C / 20 K       | 70 kg/m³         | Highest Isp rocket fuel; extremely low density; wide flammability range |
-| Liquid methane (LCH4) | −161°C / 112 K      | 424 kg/m³        | Rocket fuel; LNG transportation; ISRU candidate                         |
-| Liquid helium (LHe)   | −269°C / 4 K        | 125 kg/m³        | MRI magnets, dilution refrigerators, superconductor cooling             |
-
-## Thermodynamic behavior
-
-### Boiling and flash vaporization
-
-When pressure drops below saturation pressure, liquid flashes to vapor.
-Transfer line pressure drop must account for flash vaporization.
-Two-phase flow in transfer lines: avoid or account for — unpredictable pressure drops and potential water hammer.
-
-### Ortho/para hydrogen
-
-LH2 exists in two spin states: ortho-H₂ (75% at room temp) and para-H₂ (25% at room temp).
-At 20 K: equilibrium is >99% para-H₂.
-ortho→para conversion is exothermic. If not converted during liquefaction, conversion occurs during storage, releasing heat → boil-off.
-Solution: Use catalysts (iron oxide, chromic oxide) during liquefaction to convert to para-H₂.
-
-### Thermal stratification
-
-In large cryogenic tanks, temperature gradients form. Top warmer → higher pressure.
-"Rollover": Sudden mixing of stratified layers → rapid pressure rise → risk of relief valve opening and boil-off loss.
-Mitigation: Mixing jets, pressure management systems.
-
-## Insulation systems
-
-### Vacuum jacket (Dewar flask)
-
-Double-wall vessel with evacuated annular space.
-Residual heat transfer: radiation + residual gas conduction.
-Effective vacuum: < 10⁻³ Torr.
-
-### Multi-layer insulation (MLI)
-
-Alternating layers of aluminized Mylar (or double-aluminized Mylar) and fiberglass or silk net spacers.
-Spacing critical — too tight = conduction dominant; too loose = radiation dominant.
-Typical: 20-80 layers at 10-30 layers/cm.
-Effective conductivity: 10⁻⁵ W/m·K (vs. 0.03 W/m·K for aerogel in air).
-ONLY effective in vacuum. Worthless in air (gas conduction dominates).
-
-### Foam insulation (external cryotanks)
-
-Spray-on polyurethane foam. Primary function: prevents air liquefaction on tank surface.
-At −253°C (LH2 tank), air liquefies on uninsulated surface → dangerous LOX accumulation.
-Space Shuttle external tank foam: significant source of debris (Columbia).
-
-### Vacuum powder insulation
-
-Evacuated space filled with perlite (volcanic glass) powder.
-Simpler than MLI. Less performance. Used for large storage tanks.
-
-## Cryogenic materials
-
-### Embrittlement
-
-Many materials become brittle at cryogenic temperatures. NEVER use at cryogenic temps without verifying:
-
-- Carbon steel: brittle below −30°C. DO NOT USE for cryogenic systems.
-- Aluminum alloys (6061, 5083, 2219): maintain ductility to very low temps. Excellent for cryo.
-- Austenitic stainless steel (304, 316): good at cryogenic temps.
-- PTFE (Teflon): maintains sealing properties at cryo temps. Good for seals.
-- Brass: acceptable. Used in valves.
-- Copper: excellent. Used for heat exchangers.
-
-### Thermal contraction
-
-All materials contract when cooled. Differential contraction between dissimilar materials creates stress.
-Design rule: Calculate ΔL = L₀ × α × ΔT for all joints and connections.
-Aluminum α ≈ 23×10⁻⁶/K. From 20°C to −196°C: ΔL/L ≈ 0.5%.
-Use flexible bellows or expansion loops in piping to absorb contraction.
-
-## Storage system design
-
-### Pressure-fed systems
-
-Tank pressurized with helium or warm GH₂/GOX to push propellant to engine.
-Simple. No pumps. Weight penalty from heavy pressure vessels.
-Common for attitude control, upper stages.
-
-### Tank pressurization
-
-Prevent tank collapse during draining (ullage pressure).
-Prevent two-phase flow to engine (keep liquid subcooled).
-Pressurize with: warm autogenous gas (same propellant), or helium.
-LOX tanks typically pressurized with GOX (autogenous).
-LH₂ tanks: GH₂ or helium.
-
-### Venting and safety
-
-Cryogenic tanks must have pressure relief valves (PRVs). No exceptions.
-Liquid expansion on warming: 700:1 volume ratio for LH₂ (liquid to gas). 860:1 for LOX.
-A sealed tank warming from 20 K to 300 K will rupture catastrophically without venting.
-**Never seal a cryogenic tank without a pressure relief path.**
-
-### LOX safety rules
-
-LOX supports and accelerates combustion of any organic material.
-Never allow LOX contact with: petroleum products, organics, rubber (except specific LOX-compatible elastomers), contaminated surfaces.
-LOX compatibility test: Impact test (Liquid Oxygen Compatibility Testing, ASTM D2512).
-Stainless steel and aluminum are LOX-compatible. Copper and brass generally OK.
-Teflon (PTFE): conditionally compatible — avoid in impact/pressure environments with LOX.
-Clean rooms and LOX systems: particle-free (particles + LOX + impact = ignition risk).
-
-### LH₂ safety rules
-
-Flammability range: 4-75% in air (vs. natural gas 5-15%). Extremely wide.
-Ignition energy: 0.017 mJ (vs. 0.29 mJ for methane). Very easily ignited.
-Invisible flame: LH₂ burns with invisible flame in air. Use sensors, not visual inspection.
-Embrittlement of certain materials: some high-strength steels susceptible to hydrogen embrittlement.
-Leak detection: Thermal imaging, catalytic sensors.
-Ventilation: LH₂ is lighter than air — vents must direct upward, away from ignition sources.
-
-## Transfer operations
-
-**Chill-down:** Must cool all lines, valves, and pumps before flowing cryogenic fluid.
-Initial flow: Liquid flashes to vapor as it contacts warm surfaces → back pressure, flow interruption.
-Chill-down time: Minutes to tens of minutes for large systems.
-Transfer rate: Limited by chill-down heat load + allowable boil-off.
-**Autogenous pressurization:** Vaporize small amount of propellant in heat exchanger → use to pressurize tank.
-
-Sources: NIST Cryogenics (nvlpubs.nist.gov — free), NASA TM-2016-218560 (public domain),
-NASA Cryogenic Fluid Management technology program (public domain),
-Barron "Cryogenic Engineering" (principles), Scott "Cryogenic Engineering" (principles)
+---
+watermark: ORIRO
+disable-model-invocation: true
+name: eng-cryogenics
+provider: ORIRO.ai
+copyright: Copyright (c) 2026 ORIRO.ai
+description: >
+  Cryogenic engineering — low-temperature physics, cryogenic fluids (LOX, LH2,
+  LNG, LN2), storage systems, insulation, safety, and transfer operations.
+  Activate for cryogenic fuel handling, storage design, insulation selection,
+  or any low-temperature engineering question.
+  Sources: NIST Cryogenics (free), NASA cryogenic guidelines (public domain).
+---
+
+# Cryogenic Engineering
+
+## What cryogenics covers
+
+Cryogenics: Engineering below −150°C (123 K).
+Critical to: Rocket propellants, MRI magnets, liquefied natural gas (LNG), particle accelerators, quantum computers.
+
+## Key cryogenic fluids
+
+| Fluid                 | Boiling point (atm) | Density (liquid) | Notes                                                                   |
+| --------------------- | ------------------- | ---------------- | ----------------------------------------------------------------------- |
+| Liquid nitrogen (LN2) | −196°C / 77 K       | 808 kg/m³        | Inert, cheap, widely used for cooling                                   |
+| Liquid oxygen (LOX)   | −183°C / 90 K       | 1,141 kg/m³      | Rocket oxidizer, strong oxidizer, supports combustion                   |
+| Liquid hydrogen (LH2) | −253°C / 20 K       | 70 kg/m³         | Highest Isp rocket fuel; extremely low density; wide flammability range |
+| Liquid methane (LCH4) | −161°C / 112 K      | 424 kg/m³        | Rocket fuel; LNG transportation; ISRU candidate                         |
+| Liquid helium (LHe)   | −269°C / 4 K        | 125 kg/m³        | MRI magnets, dilution refrigerators, superconductor cooling             |
+
+## Thermodynamic behavior
+
+### Boiling and flash vaporization
+
+When pressure drops below saturation pressure, liquid flashes to vapor.
+Transfer line pressure drop must account for flash vaporization.
+Two-phase flow in transfer lines: avoid or account for — unpredictable pressure drops and potential water hammer.
+
+### Ortho/para hydrogen
+
+LH2 exists in two spin states: ortho-H₂ (75% at room temp) and para-H₂ (25% at room temp).
+At 20 K: equilibrium is >99% para-H₂.
+ortho→para conversion is exothermic. If not converted during liquefaction, conversion occurs during storage, releasing heat → boil-off.
+Solution: Use catalysts (iron oxide, chromic oxide) during liquefaction to convert to para-H₂.
+
+### Thermal stratification
+
+In large cryogenic tanks, temperature gradients form. Top warmer → higher pressure.
+"Rollover": Sudden mixing of stratified layers → rapid pressure rise → risk of relief valve opening and boil-off loss.
+Mitigation: Mixing jets, pressure management systems.
+
+## Insulation systems
+
+### Vacuum jacket (Dewar flask)
+
+Double-wall vessel with evacuated annular space.
+Residual heat transfer: radiation + residual gas conduction.
+Effective vacuum: < 10⁻³ Torr.
+
+### Multi-layer insulation (MLI)
+
+Alternating layers of aluminized Mylar (or double-aluminized Mylar) and fiberglass or silk net spacers.
+Spacing critical — too tight = conduction dominant; too loose = radiation dominant.
+Typical: 20-80 layers at 10-30 layers/cm.
+Effective conductivity: 10⁻⁵ W/m·K (vs. 0.03 W/m·K for aerogel in air).
+ONLY effective in vacuum. Worthless in air (gas conduction dominates).
+
+### Foam insulation (external cryotanks)
+
+Spray-on polyurethane foam. Primary function: prevents air liquefaction on tank surface.
+At −253°C (LH2 tank), air liquefies on uninsulated surface → dangerous LOX accumulation.
+Space Shuttle external tank foam: significant source of debris (Columbia).
+
+### Vacuum powder insulation
+
+Evacuated space filled with perlite (volcanic glass) powder.
+Simpler than MLI. Less performance. Used for large storage tanks.
+
+## Cryogenic materials
+
+### Embrittlement
+
+Many materials become brittle at cryogenic temperatures. NEVER use at cryogenic temps without verifying:
+
+- Carbon steel: brittle below −30°C. DO NOT USE for cryogenic systems.
+- Aluminum alloys (6061, 5083, 2219): maintain ductility to very low temps. Excellent for cryo.
+- Austenitic stainless steel (304, 316): good at cryogenic temps.
+- PTFE (Teflon): maintains sealing properties at cryo temps. Good for seals.
+- Brass: acceptable. Used in valves.
+- Copper: excellent. Used for heat exchangers.
+
+### Thermal contraction
+
+All materials contract when cooled. Differential contraction between dissimilar materials creates stress.
+Design rule: Calculate ΔL = L₀ × α × ΔT for all joints and connections.
+Aluminum α ≈ 23×10⁻⁶/K. From 20°C to −196°C: ΔL/L ≈ 0.5%.
+Use flexible bellows or expansion loops in piping to absorb contraction.
+
+## Storage system design
+
+### Pressure-fed systems
+
+Tank pressurized with helium or warm GH₂/GOX to push propellant to engine.
+Simple. No pumps. Weight penalty from heavy pressure vessels.
+Common for attitude control, upper stages.
+
+### Tank pressurization
+
+Prevent tank collapse during draining (ullage pressure).
+Prevent two-phase flow to engine (keep liquid subcooled).
+Pressurize with: warm autogenous gas (same propellant), or helium.
+LOX tanks typically pressurized with GOX (autogenous).
+LH₂ tanks: GH₂ or helium.
+
+### Venting and safety
+
+Cryogenic tanks must have pressure relief valves (PRVs). No exceptions.
+Liquid expansion on warming: 700:1 volume ratio for LH₂ (liquid to gas). 860:1 for LOX.
+A sealed tank warming from 20 K to 300 K will rupture catastrophically without venting.
+**Never seal a cryogenic tank without a pressure relief path.**
+
+### LOX safety rules
+
+LOX supports and accelerates combustion of any organic material.
+Never allow LOX contact with: petroleum products, organics, rubber (except specific LOX-compatible elastomers), contaminated surfaces.
+LOX compatibility test: Impact test (Liquid Oxygen Compatibility Testing, ASTM D2512).
+Stainless steel and aluminum are LOX-compatible. Copper and brass generally OK.
+Teflon (PTFE): conditionally compatible — avoid in impact/pressure environments with LOX.
+Clean rooms and LOX systems: particle-free (particles + LOX + impact = ignition risk).
+
+### LH₂ safety rules
+
+Flammability range: 4-75% in air (vs. natural gas 5-15%). Extremely wide.
+Ignition energy: 0.017 mJ (vs. 0.29 mJ for methane). Very easily ignited.
+Invisible flame: LH₂ burns with invisible flame in air. Use sensors, not visual inspection.
+Embrittlement of certain materials: some high-strength steels susceptible to hydrogen embrittlement.
+Leak detection: Thermal imaging, catalytic sensors.
+Ventilation: LH₂ is lighter than air — vents must direct upward, away from ignition sources.
+
+## Transfer operations
+
+**Chill-down:** Must cool all lines, valves, and pumps before flowing cryogenic fluid.
+Initial flow: Liquid flashes to vapor as it contacts warm surfaces → back pressure, flow interruption.
+Chill-down time: Minutes to tens of minutes for large systems.
+Transfer rate: Limited by chill-down heat load + allowable boil-off.
+**Autogenous pressurization:** Vaporize small amount of propellant in heat exchanger → use to pressurize tank.
+
+Sources: NIST Cryogenics (nvlpubs.nist.gov — free), NASA TM-2016-218560 (public domain),
+NASA Cryogenic Fluid Management technology program (public domain),
+Barron "Cryogenic Engineering" (principles), Scott "Cryogenic Engineering" (principles)

package/skills/engineering/eng-electrical/LICENSE

@@ -1,21 +1,21 @@
-MIT License
-
-Copyright (c) 2026 ORIRO.ai
-
-Permission is hereby granted, free of charge, to any person obtaining a copy
-of this software and associated documentation files (the "Software"), to deal
-in the Software without restriction, including without limitation the rights
-to use, copy, modify, merge, publish, distribute, sublicense, and/or sell
-copies of the Software, and to permit persons to whom the Software is
-furnished to do so, subject to the following conditions:
-
-The above copyright notice and this permission notice shall be included in all
-copies or substantial portions of the Software.
-
-THE SOFTWARE IS PROVIDED "AS IS", WITHOUT WARRANTY OF ANY KIND, EXPRESS OR
-IMPLIED, INCLUDING BUT NOT LIMITED TO THE WARRANTIES OF MERCHANTABILITY,
-FITNESS FOR A PARTICULAR PURPOSE AND NONINFRINGEMENT. IN NO EVENT SHALL THE
-AUTHORS OR COPYRIGHT HOLDERS BE LIABLE FOR ANY CLAIM, DAMAGES OR OTHER
-LIABILITY, WHETHER IN AN ACTION OF CONTRACT, TORT OR OTHERWISE, ARISING FROM,
-OUT OF OR IN CONNECTION WITH THE SOFTWARE OR THE USE OR OTHER DEALINGS IN THE
-SOFTWARE.
+MIT License
+
+Copyright (c) 2026 ORIRO.ai
+
+Permission is hereby granted, free of charge, to any person obtaining a copy
+of this software and associated documentation files (the "Software"), to deal
+in the Software without restriction, including without limitation the rights
+to use, copy, modify, merge, publish, distribute, sublicense, and/or sell
+copies of the Software, and to permit persons to whom the Software is
+furnished to do so, subject to the following conditions:
+
+The above copyright notice and this permission notice shall be included in all
+copies or substantial portions of the Software.
+
+THE SOFTWARE IS PROVIDED "AS IS", WITHOUT WARRANTY OF ANY KIND, EXPRESS OR
+IMPLIED, INCLUDING BUT NOT LIMITED TO THE WARRANTIES OF MERCHANTABILITY,
+FITNESS FOR A PARTICULAR PURPOSE AND NONINFRINGEMENT. IN NO EVENT SHALL THE
+AUTHORS OR COPYRIGHT HOLDERS BE LIABLE FOR ANY CLAIM, DAMAGES OR OTHER
+LIABILITY, WHETHER IN AN ACTION OF CONTRACT, TORT OR OTHERWISE, ARISING FROM,
+OUT OF OR IN CONNECTION WITH THE SOFTWARE OR THE USE OR OTHER DEALINGS IN THE
+SOFTWARE.

package/skills/engineering/eng-electrical/SKILL.md

@@ -1,70 +1,70 @@
----
-watermark: ORIRO
-disable-model-invocation: true
-name: eng-electrical
-provider: ORIRO.ai
-copyright: Copyright (c) 2026 ORIRO.ai
-description: >
-
-  Electrical engineering — circuits, power systems, electronics, digital systems, signal processing, and electromagnetic fundamentals.
-
-
-
-
-
-  Sources: MIT OCW, ASME principles, OSHA, engineering textbook fundamentals.
-  Consult a licensed professional engineer for safety-critical calculations.
----
-
-# Electrical Engineering Fundamentals
-
-## DC circuit fundamentals
-
-**Ohm's Law:** V = IR (Voltage = Current × Resistance)
-**Power:** P = VI = I²R = V²/R (Watts)
-**Kirchhoff's Voltage Law (KVL):** Sum of voltages around any closed loop = 0.
-**Kirchhoff's Current Law (KCL):** Sum of currents entering a node = sum leaving.
-**Series resistors:** R_total = R₁ + R₂ + R₃...
-**Parallel resistors:** 1/R_total = 1/R₁ + 1/R₂ + 1/R₃...
-
-## AC circuits
-
-**AC voltage:** v(t) = Vm·sin(ωt + φ). ω = 2πf (angular frequency)
-**RMS:** V_rms = Vm/√2. P_avg = V_rms × I_rms × cos(φ)
-**Impedance:** Z = R + jX. Magnitude |Z| = √(R² + X²).
-**Inductor impedance:** Z_L = jωL (increases with frequency)
-**Capacitor impedance:** Z_C = 1/(jωC) (decreases with frequency)
-**Resonance:** Z is purely resistive. f₀ = 1/(2π√LC)
-
-## Semiconductors and transistors
-
-**Diode:** One-way current flow. Forward voltage ~0.7V (silicon). Rectification, protection, signal demodulation.
-**MOSFET (most common):** Voltage-controlled switch/amplifier.
-n-channel MOSFET: Gate voltage turns it ON. Used in most digital logic and power switching.
-Gate-Source voltage (V_GS) > threshold voltage → channel conducts.
-**BJT:** Current-controlled amplifier. β = I_C/I_B (typical 50-300).
-
-## Digital logic
-
-**Boolean algebra:** AND, OR, NOT, NAND, NOR, XOR.
-NAND is universal gate — any logic can be built from NAND gates alone.
-**Combinational logic:** Output depends only on current inputs. Adders, multiplexers, decoders.
-**Sequential logic:** Output depends on inputs AND previous state. Flip-flops, registers, counters.
-**D flip-flop:** Captures input D at clock edge. Foundation of digital memory and state machines.
-
-## Power systems
-
-**Three-phase power:** Most efficient for large power transmission. Three phases 120° apart.
-P = √3 × V_L × I_L × cos(φ) (V_L = line-to-line voltage)
-**Transformers:** Step voltage up/down. V₁/V₂ = N₁/N₂. Ideal: V₁I₁ = V₂I₂.
-**Power factor:** cos(φ) = real power/apparent power. Low PF = inefficient, utility penalizes.
-
-## PCB design basics
-
-**Trace width:** Determine from current capacity and temperature rise. Online calculators essential.
-**Ground planes:** Provide low-impedance return path. Reduce EMI.
-**Bypass capacitors:** Place close to each IC power pin. 100nF ceramic standard.
-**Differential pairs:** For high-speed signals. Keep traces matched in length.
-
-Sources: MIT OCW 6.002 Circuits and Electronics, Sedra/Smith Microelectronic Circuits (principles),
-Horowitz & Hill The Art of Electronics (principles), IEEE standards
+---
+watermark: ORIRO
+disable-model-invocation: true
+name: eng-electrical
+provider: ORIRO.ai
+copyright: Copyright (c) 2026 ORIRO.ai
+description: >
+
+  Electrical engineering — circuits, power systems, electronics, digital systems, signal processing, and electromagnetic fundamentals.
+
+
+
+
+
+  Sources: MIT OCW, ASME principles, OSHA, engineering textbook fundamentals.
+  Consult a licensed professional engineer for safety-critical calculations.
+---
+
+# Electrical Engineering Fundamentals
+
+## DC circuit fundamentals
+
+**Ohm's Law:** V = IR (Voltage = Current × Resistance)
+**Power:** P = VI = I²R = V²/R (Watts)
+**Kirchhoff's Voltage Law (KVL):** Sum of voltages around any closed loop = 0.
+**Kirchhoff's Current Law (KCL):** Sum of currents entering a node = sum leaving.
+**Series resistors:** R_total = R₁ + R₂ + R₃...
+**Parallel resistors:** 1/R_total = 1/R₁ + 1/R₂ + 1/R₃...
+
+## AC circuits
+
+**AC voltage:** v(t) = Vm·sin(ωt + φ). ω = 2πf (angular frequency)
+**RMS:** V_rms = Vm/√2. P_avg = V_rms × I_rms × cos(φ)
+**Impedance:** Z = R + jX. Magnitude |Z| = √(R² + X²).
+**Inductor impedance:** Z_L = jωL (increases with frequency)
+**Capacitor impedance:** Z_C = 1/(jωC) (decreases with frequency)
+**Resonance:** Z is purely resistive. f₀ = 1/(2π√LC)
+
+## Semiconductors and transistors
+
+**Diode:** One-way current flow. Forward voltage ~0.7V (silicon). Rectification, protection, signal demodulation.
+**MOSFET (most common):** Voltage-controlled switch/amplifier.
+n-channel MOSFET: Gate voltage turns it ON. Used in most digital logic and power switching.
+Gate-Source voltage (V_GS) > threshold voltage → channel conducts.
+**BJT:** Current-controlled amplifier. β = I_C/I_B (typical 50-300).
+
+## Digital logic
+
+**Boolean algebra:** AND, OR, NOT, NAND, NOR, XOR.
+NAND is universal gate — any logic can be built from NAND gates alone.
+**Combinational logic:** Output depends only on current inputs. Adders, multiplexers, decoders.
+**Sequential logic:** Output depends on inputs AND previous state. Flip-flops, registers, counters.
+**D flip-flop:** Captures input D at clock edge. Foundation of digital memory and state machines.
+
+## Power systems
+
+**Three-phase power:** Most efficient for large power transmission. Three phases 120° apart.
+P = √3 × V_L × I_L × cos(φ) (V_L = line-to-line voltage)
+**Transformers:** Step voltage up/down. V₁/V₂ = N₁/N₂. Ideal: V₁I₁ = V₂I₂.
+**Power factor:** cos(φ) = real power/apparent power. Low PF = inefficient, utility penalizes.
+
+## PCB design basics
+
+**Trace width:** Determine from current capacity and temperature rise. Online calculators essential.
+**Ground planes:** Provide low-impedance return path. Reduce EMI.
+**Bypass capacitors:** Place close to each IC power pin. 100nF ceramic standard.
+**Differential pairs:** For high-speed signals. Keep traces matched in length.
+
+Sources: MIT OCW 6.002 Circuits and Electronics, Sedra/Smith Microelectronic Circuits (principles),
+Horowitz & Hill The Art of Electronics (principles), IEEE standards

package/skills/engineering/eng-electronics-embedded/LICENSE

@@ -1,21 +1,21 @@
-MIT License
-
-Copyright (c) 2026 ORIRO.ai
-
-Permission is hereby granted, free of charge, to any person obtaining a copy
-of this software and associated documentation files (the "Software"), to deal
-in the Software without restriction, including without limitation the rights
-to use, copy, modify, merge, publish, distribute, sublicense, and/or sell
-copies of the Software, and to permit persons to whom the Software is
-furnished to do so, subject to the following conditions:
-
-The above copyright notice and this permission notice shall be included in all
-copies or substantial portions of the Software.
-
-THE SOFTWARE IS PROVIDED "AS IS", WITHOUT WARRANTY OF ANY KIND, EXPRESS OR
-IMPLIED, INCLUDING BUT NOT LIMITED TO THE WARRANTIES OF MERCHANTABILITY,
-FITNESS FOR A PARTICULAR PURPOSE AND NONINFRINGEMENT. IN NO EVENT SHALL THE
-AUTHORS OR COPYRIGHT HOLDERS BE LIABLE FOR ANY CLAIM, DAMAGES OR OTHER
-LIABILITY, WHETHER IN AN ACTION OF CONTRACT, TORT OR OTHERWISE, ARISING FROM,
-OUT OF OR IN CONNECTION WITH THE SOFTWARE OR THE USE OR OTHER DEALINGS IN THE
-SOFTWARE.
+MIT License
+
+Copyright (c) 2026 ORIRO.ai
+
+Permission is hereby granted, free of charge, to any person obtaining a copy
+of this software and associated documentation files (the "Software"), to deal
+in the Software without restriction, including without limitation the rights
+to use, copy, modify, merge, publish, distribute, sublicense, and/or sell
+copies of the Software, and to permit persons to whom the Software is
+furnished to do so, subject to the following conditions:
+
+The above copyright notice and this permission notice shall be included in all
+copies or substantial portions of the Software.
+
+THE SOFTWARE IS PROVIDED "AS IS", WITHOUT WARRANTY OF ANY KIND, EXPRESS OR
+IMPLIED, INCLUDING BUT NOT LIMITED TO THE WARRANTIES OF MERCHANTABILITY,
+FITNESS FOR A PARTICULAR PURPOSE AND NONINFRINGEMENT. IN NO EVENT SHALL THE
+AUTHORS OR COPYRIGHT HOLDERS BE LIABLE FOR ANY CLAIM, DAMAGES OR OTHER
+LIABILITY, WHETHER IN AN ACTION OF CONTRACT, TORT OR OTHERWISE, ARISING FROM,
+OUT OF OR IN CONNECTION WITH THE SOFTWARE OR THE USE OR OTHER DEALINGS IN THE
+SOFTWARE.