jscad-electronics 0.0.173 → 0.0.175

package/dist/index.d.ts

@@ -51,6 +51,27 @@ interface BGAProps {
 }
 declare const BGA: ({ packageWidth, packageLength, packageHeight, standoffHeight, ballPitch, ballDiameter, ballRows, ballColumns, missingBalls, footprintString, }: BGAProps) => react_jsx_runtime.JSX.Element;
 
+/** Molded perimeter-land LGA. Opposite rows have equal counts; adjacent rows
+ * may differ. Pads remain entirely under the body, with no QFN exposed pad.
+ * X crosses the left/right rows. Pin 1 is at -X,+Y; dimensions are in mm.
+ * This models the external envelope, not sensor-specific lids or apertures.
+ */
+interface LGAProps {
+    bodyWidth: number;
+    bodyLength: number;
+    bodyHeight: number;
+    landsPerSideX: number;
+    landsPerSideY: number;
+    pitch: number;
+    landWidth: number;
+    landLength: number;
+    /** Distance from the body edge to the outer edge of each land. */
+    edgeInset: number;
+    /** Representative metallization thickness, not solder standoff. */
+    landThickness: number;
+}
+declare function LGA(p: LGAProps): react_jsx_runtime.JSX.Element;
+
 interface ChipBodyProps {
     width: number;
     length: number;
@@ -215,6 +236,13 @@ declare const LegacySOIC: ({ pinCount, leadLength, leadWidth, pitch, bodyWidth,
 type SOICProps = Parameters<typeof LegacySOIC>[0] | DualRowGullWingDimensions;
 declare const SOIC: (props: SOICProps) => react_jsx_runtime.JSX.Element;
 
+/** Explicit SSOP physical outline (e.g. JEDEC MO-150), in mm. Copper land
+ * dimensions do not identify the package. Pin 1 is at -X,+Y; Z=0 seats the feet.
+ * Mold draft, bend curvature and the pin-1 dimple are visual approximations.
+ */
+type SSOPProps = Omit<DualRowGullWingDimensions, "exposedPadWidth" | "exposedPadLength">;
+declare const SSOP: (props: SSOPProps) => react_jsx_runtime.JSX.Element;
+
 declare const LegacyTssop: ({ pinCount, leadLength, leadWidth, pitch, bodyWidth, }: {
     pinCount: number;
     pitch: number;
@@ -1225,4 +1253,4 @@ declare const MelfResistor: ({ size, footprint, }: {
     footprint?: string;
 }) => react_jsx_runtime.JSX.Element;
 
-export { A01005, A0201, A0402, A0603, A0805, A1206, A1210, A2010, A2512, AxialCapacitor, BGA, CeramicChipAntenna, ChipBody, type ChipBodyProps, Crystal, type CrystalProps, DFN, DO219AD, type DO219ADProps, DPAK, type DPAKProps, Display, ElectrolyticCapacitor, type ElectrolyticCapacitorProps, ExtrudedPads, FPC, type FPCProps, FemaleHeader, FemaleHeaderRow, FlexScreen, type FlexScreenAspectRatio, type FlexScreenOrientation, type FlexScreenProps, FootprintPad, FootprintPlatedHole, Footprinter3d, GullWingBody, type GullWingBodyProps, HC49, type HC49Props, JSTPH2_0mm, JSTXH2_5mm, type JSTXH2_5mmProps, JSTZH1_5mm, JstSh, LQFP, type LQFPProps, Led2835, type Led2835Props, Led5050, type Led5050Props, MELF, type MELFProps, MINIMELF, type MINIMELFProps, MS012, MS013, MSOP, type MSOPProps, MelfResistor, type MelfResistorSize, MicroMELF, type MicroMELFProps, MountedPcbModule, PinHeader, PinRow, Potentiometer, type PotentiometerLead, type PotentiometerProps, QFN, type QFNProps, QFP, RJ45, type RJ45Props, type ResolvedFlexScreenSize, SMA, SMB, SMC, SMF, SOD123, SOD123F, SOD123FL, type SOD123Props, SOD123W, type SOD123WProps, SOD128, SOD323, SOD323F, SOD323FL, SOD323HE, type SOD323HEProps, SOD523, SOD723, SOD882, SOD923, SOIC, type SOICProps, SOT143, SOT223, type SOT223Props, SOT233P, SOT23W, SOT323, SOT363, SOT457, SOT563, SOT723, SOT886, SOT963, Screen, type ScreenProps, SmdChipLead, type SmdChipLeadProps, type SmdLeadPad, SmdPinHeader, type SmdPinHeaderProps, SmdPushButton, type SmdPushButtonProps, SmdSlideSwitch, StampBoard, TO220, type TO220Lead, type TO220Props, TO92, type TO92Lead, type TO92Props, TQFP, TantalumCapacitor, type TantalumCase, Tssop, type TssopProps, TwoPadCrystal, type TwoPadCrystalPackage, UsbCMidmount, VSSOP, isJstShFootprint, melfResistorSizes, resolveFlexScreenSize, tantalumCases, twoPadCrystalPackages };
+export { A01005, A0201, A0402, A0603, A0805, A1206, A1210, A2010, A2512, AxialCapacitor, BGA, CeramicChipAntenna, ChipBody, type ChipBodyProps, Crystal, type CrystalProps, DFN, DO219AD, type DO219ADProps, DPAK, type DPAKProps, Display, ElectrolyticCapacitor, type ElectrolyticCapacitorProps, ExtrudedPads, FPC, type FPCProps, FemaleHeader, FemaleHeaderRow, FlexScreen, type FlexScreenAspectRatio, type FlexScreenOrientation, type FlexScreenProps, FootprintPad, FootprintPlatedHole, Footprinter3d, GullWingBody, type GullWingBodyProps, HC49, type HC49Props, JSTPH2_0mm, JSTXH2_5mm, type JSTXH2_5mmProps, JSTZH1_5mm, JstSh, LGA, type LGAProps, LQFP, type LQFPProps, Led2835, type Led2835Props, Led5050, type Led5050Props, MELF, type MELFProps, MINIMELF, type MINIMELFProps, MS012, MS013, MSOP, type MSOPProps, MelfResistor, type MelfResistorSize, MicroMELF, type MicroMELFProps, MountedPcbModule, PinHeader, PinRow, Potentiometer, type PotentiometerLead, type PotentiometerProps, QFN, type QFNProps, QFP, RJ45, type RJ45Props, type ResolvedFlexScreenSize, SMA, SMB, SMC, SMF, SOD123, SOD123F, SOD123FL, type SOD123Props, SOD123W, type SOD123WProps, SOD128, SOD323, SOD323F, SOD323FL, SOD323HE, type SOD323HEProps, SOD523, SOD723, SOD882, SOD923, SOIC, type SOICProps, SOT143, SOT223, type SOT223Props, SOT233P, SOT23W, SOT323, SOT363, SOT457, SOT563, SOT723, SOT886, SOT963, SSOP, type SSOPProps, Screen, type ScreenProps, SmdChipLead, type SmdChipLeadProps, type SmdLeadPad, SmdPinHeader, type SmdPinHeaderProps, SmdPushButton, type SmdPushButtonProps, SmdSlideSwitch, StampBoard, TO220, type TO220Lead, type TO220Props, TO92, type TO92Lead, type TO92Props, TQFP, TantalumCapacitor, type TantalumCase, Tssop, type TssopProps, TwoPadCrystal, type TwoPadCrystalPackage, UsbCMidmount, VSSOP, isJstShFootprint, melfResistorSizes, resolveFlexScreenSize, tantalumCases, twoPadCrystalPackages };