biscuitboard 1.0.4 → 1.0.5
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- package/README.md +3 -2
- package/package.json +3 -3
package/README.md
CHANGED
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@@ -109,8 +109,9 @@ and the Arduino UNO R3 shield at the upper-right. The 32 mm square clad replaces
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one standard and one perforated XIAO below the breadboard; the remaining
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standard and perforated XIAOs sit above it, with the Feather alongside. The TI
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BoosterPack remains at the lower-right. The resulting fabrication panel remains
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158 mm x 118 mm, with 2 mm
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-
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158 mm x 118 mm, with 2 mm board gaps and 3 mm edge rails. The default
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`outline_routing` panelization method creates continuous routed cutouts around
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every board without tabs or mouse bites.
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```sh
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bun run build:clad-panel
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package/package.json
CHANGED
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@@ -1,6 +1,6 @@
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{
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"name": "biscuitboard",
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"version": "1.0.
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"version": "1.0.5",
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"description": "Prefabricated copper-clad board wrappers and fixed-via autorouting for tscircuit",
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"license": "MIT",
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"type": "module",
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@@ -109,8 +109,8 @@
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"typescript": "5.9.3"
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},
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"dependencies": {
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"@tscircuit/core": "0.0.
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"@tscircuit/props": "0.0.
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"@tscircuit/core": "0.0.1696",
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"@tscircuit/props": "0.0.623"
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},
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"peerDependencies": {
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"react": "^19.1.0"
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