biscuitboard 1.0.18 → 1.0.20

package/README.md

@@ -71,6 +71,41 @@ denser [`examples/rp2040.tsx`](./examples/rp2040.tsx) example uses the RP2040
 module from `@tsci/seveibar.common` and is also checked in with solved PCB and
 schematic snapshots.
 
+## Pre-routed breadboard clad with 0.8 mm vias
+
+[`BreadboardClad08mmVias`](./lib/breadboard-clad-0.8mm-vias.tsx) retains the
+75 mm x 55 mm breadboard-clad outline and 10 x 21 socket grid while adding the
+standard breadboard connectivity in copper. For every numbered column, A-E
+form one five-socket terminal strip and F-J form the other. Each strip reaches
+a trace-only breakout on both its inner and outer side.
+
+The 50 vias are separate from the breadboard strips and sit in four
+two-via-wide L-shaped corner fields. Three corners have five columns along the
+board's long side; the top-right has a sixth pitch-aligned column beneath the
+second mounting hole, while the short arms remain beside the mounting holes.
+In every corner, the four vias in the two innermost long-side columns shift one
+3 mm pitch toward the top or bottom edge, extending the edge-hugging row without
+changing the grid pitch.
+Every via has its own 0.15 mm top- and bottom-copper breakout: the top trace
+reaches one inward open-area edge and the bottom trace reaches the opposite
+inward open-area edge. Breakouts from boundary vias take direct paths; recessed
+breakouts weave through the 3 mm via gaps until every endpoint sits 1 mm beyond
+the inward edge of the L-shaped via grid. The endpoints remain in the open space
+between corner fields, where connectors, components, and later copper fills can
+sit. On the bottom layer, the shifted H2 escape and both short-arm escapes take
+staggered lanes behind the outer via row before turning inward, so they do not
+wall off another via. No via breakout is collected at a board edge or routed
+toward a mounting hole. The vias use 0.8 mm finished holes and 0.9 mm pads,
+leaving 2.1 mm between pad edges and 2.2 mm between drill edges. The bare routed
+preview and checked-in PCB snapshot are in
+[`examples/breadboard-clad-0.8mm-vias.tsx`](./examples/breadboard-clad-0.8mm-vias.tsx).
+
+```sh
+bun run build:breadboard-clad-0.8mm-vias
+bun run snapshot:breadboard-clad-0.8mm-vias
+bun test tests/breadboard-clad-0.8mm-vias.test.tsx
+```
+
 ## 40 mm square clad
 
 [`Clad40x40`](./lib/Clad40x40.tsx) is a two-layer 40 mm x 40 mm clad without