@windypro-rourou/dsh-eda 0.1.0 → 0.1.1

package/skill/format/pcb/component.md

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+# Footprint System
+
+PCB footprints use a Master/Instance model, describing footprints through override rules with minimal redundancy.
+
+## COMPONENT Component Instance
+
+Instances only contain attributes. Attributes with the same `Key` in the instance will override those in the `FOOTPRINT`.
+
+```json
+{ "type": "COMPONENT", "id":"UUID", "ticket": 1 }||
+{
+  "partitionId":null,
+  "groupId":0,
+  "locked":1,
+  "zIndex":0.22,
+  "layerId":1,
+  "positionX":150,
+  "positionY":200,
+  "angle":45,
+  "attrs":{ "3D Model": "uuid", "3D Model Transform": "20,10,0,0,15,45,0,0,20" },
+}|
+```
+
+1. type instance `COMPONENT`.
+2. id primitive ID, unique within the document.
+3. ticket logical clock.
+4. partitionId partition ID it belongs to, null means no partition. Ignored for footprints.
+5. groupId group ID: 0 no group, non-zero is the group flag, same flag means same group.
+6. locked whether locked.
+7. zIndex Z-axis height.
+8. layerId layer (only top and bottom).
+9. positionX position X.
+10. positionY position Y.
+11. angle rotation angle.
+12. attrs custom attributes.
+    - Fixed `3D Model` is the uuid of the 3D model. This uuid represents a record with doctype = 16 in the components table.
+    - Fixed `3D Model Transform` is the 3D model transformation parameters.
+
+```json
+["ATTR", "e102", 0, "e8", 1, "Designator", "U1", 0, 1, "SimSun", 50, 10, 0, 0, 0, 1, 2, 15, 1, 1]
+```
+
+```json
+["ATTR", "e103", 0, "e8", 1, "Footprint", "footprint-uuid", 0, 1, "SimSun", 50, 10, 0, 0, 0, 1, 2, 15, 1, 1]
+```
+
+```json
+["ATTR", "e104", 0, "e8", 1, "Device", "device-uuid", 0, 1, "SimSun", 50, 10, 0, 0, 0, 1, 2, 15, 1, 1]
+```
+
+### Pad-Net Mapping `PAD_NET`
+
+```json
+{ "type": "PAD_NET", "id":"COMPONENT_UUID", "ticket": 1 }||
+{
+  "padNum":"a1",
+  "padNet":"GND",
+  "padId":"e125",
+}|
+```
+
+1. type pad-net mapping `PAD_NET`.
+2. id parent component instance ID.
+3. ticket logical clock.
+4. padNum pad number.
+5. padNet net name.
+6. padId pad ID inside the footprint (optional).
+
+### Reuse Block Information `REUSE_BLOCK`
+
+```json
+{ "type": "REUSE_BLOCK", "id":"COMPONENT_UUID", "ticket": 1 }||
+{
+  "groupId":"$1e16",
+  "channelId":"$2e5_$4e3",
+}|
+```
+
+1. type reuse block information `REUSE_BLOCK`.
+2. id parent component instance ID.
+3. groupId group ID.
+4. channelId channel ID.
+
+### 3D Model Transform Special Notes
+
+```json
+{ "type": "COMPONENT", "id":"UUID", "ticket": 1 }||
+{
+  "partitionId":null,
+  "groupId":0,
+  "locked":1,
+  "zIndex":0.22,
+  "layerId":1,
+  "positionX":150,
+  "positionY":200,
+  "angle":45,
+  "attrs":{ "3D Model": "uuid", "3D Model Transform": "20,10,0,0,15,45,0,0,20" },
+}|
+```
+
+In the device, `3D Model Transform` is fixed as the transformation parameters required for the 3D model to match the device when it is [on the top layer], at [coordinates 0,0], and [rotation angle 0].
+
+The parameters are:
+
+1. sizeX: X-axis size.
+2. sizeY: Y-axis size.
+3. sizeZ: Z-axis size. There is a compatibility handling here: if 0, height is automatically adapted.
+4. rotZ: rotation angle around Z axis.
+5. rotX: rotation angle around X axis.
+6. rotY: rotation angle around Y axis.
+7. offX: X-axis offset.
+8. offY: Y-axis offset.
+9. offZ: Z-axis offset.
+
+The algorithm for generating the 3D model transformation matrix from the 3D model transform parameters is as follows:
+
+```python
+cx = X-axis midpoint of the 3D model
+cy = Y-axis midpoint of the 3D model
+bz = minimum Z value of the 3D model
+
+wx = X-axis width of the 3D model
+wy = Y-axis width of the 3D model
+wz = Z-axis width of the 3D model
+
+ORIGIN = translate(-cx, -cy, -bz)
+SCALE = scale(sizeX / wx, sizeY / wy, sizeZ / wz)
+ROT = rotateZXY(rotZ, rotX, rotY)
+OFFSET = translate(offX, offY, offZ)
+
+MATRIX = OFFSET X ROT X SCALE X ORIGIN
+```

package/skill/format/pcb/dimension.md

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+# DIMENSION Dimension Tool Set
+
+```json
+{ "type": "DIMENSION", "id":"UUID", "ticket": 1 }||
+{
+  "partitionId":null,
+  "groupId":0,
+  "locked":1,
+  "zIndex":2.221,
+  "type":"RADIUS",
+  "layerId":3,
+  "unit":"mm",
+  "strokeWidth":0.5,
+  "precision":3,
+  "textFollow":1,
+  "coords": [100 200 300 400 400 400],
+}|
+["DIMENSION", "e101", 0, 1, 2.221, "RADIUS", 3, "mm", 0.5, 3, 1, [100 200 300 400 400 400]]
+```
+
+1. type dimension tool `DIMENSION`.
+2. id primitive ID, unique within the document.
+3. ticket logical clock.
+4. partitionId partition ID it belongs to, null means no partition. Ignored for footprints.
+5. groupId group ID: 0 no group, non-zero is the group flag, same flag means same group.
+6. locked whether locked.
+7. zIndex Z-axis height.
+8. type dimension type: `RADIUS` radius, `LENGTH` length, `ANGLE` angle.
+9. layerId layer.
+10. unit unit: `mm`, `cm`, `inch`, `mil`.
+11. strokeWidth line width.
+12. precision precision.
+13. textFollow whether text follows: `1` tool automatically decides text position, `0` always use the position of `ATTR`.
+14. coords coordinate set X1 Y1 X2 Y2 X3 Y3 ... different dimension types define coordinates differently.
+
+```json
+["ATTR", "e102", 0, "e101", 1, 200, 150, "VALUE", "1234mm", 0, 1, "SimSun", 50, 10, 0, 0, 0, 2, 15, 1, 1]
+```
+
+`DIMENSION` needs to be accompanied by an attribute with Key `VALUE` to express the text part of the dimension tool. EDA should ignore unnecessary properties such as `whether to display Key` and `whether to display Value`.
+
+### RADIUS Radius Tool
+
+The first coordinate of the coordinate set is the endpoint touching the ARC, and the last coordinate is the default endpoint for displaying text, as shown below.
+
+![image](/storage/images/cn/format/pcb/dimension/dim_radius.png)
+
+### LENGTH Length Tool
+
+The coordinate set only needs four points, as shown below.
+
+![image](/storage/images/cn/format/pcb/dimension/dim_length.png)
+
+### ANGLE Angle Tool
+
+The coordinate set needs 3 points, as shown below.
+
+![image](/storage/images/cn/format/pcb/dimension/dim_angle.png)

package/skill/format/pcb/index.md

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+# PCB Format Document
+
+This chapter details the format specification of the EasyEDA PCB file. PCB files mainly consist of the following parts:
+
+- [Common Format](/en/format/pcb/common.md): document header, canvas, layers, physical layers, preferences, etc.
+- [Partition Format](/en/format/pcb/partition.md): partition definitions.
+- [Basic Primitives](/en/format/pcb/primitive.md): nets, primitive configurations, groups, silkscreen configurations, associations, attributes, etc.
+- [Pads and Vias](/en/format/pcb/pad_via.md): pads and vias.
+- [Shape Primitives](/en/format/pcb/shape.md): lines, arcs, polygon systems, polylines, fills, regions, copper pours, images, teardrops, etc.
+- [Binary Objects](/en/format/pcb/obj.md): embedded objects.
+- [3D Shell](/en/format/pcb/3d.md): shells, creases, entities, bosses.
+- [Text System](/en/format/pcb/text.md): text.
+- [Attributes](/en/format/pcb/attr.md): attributes.
+- [Dimension Tools](/en/format/pcb/dimension.md): dimension annotations.
+- [Footprint System](/en/format/pcb/component.md): component instances.
+- [Design Rules](/en/format/pcb/rule.md): rule templates, rule definitions, rule selectors.
+- [Panelization](/en/format/pcb/panel.md): panelization parameters.

package/skill/format/pcb/obj.md

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+# OBJ Binary Embedded Object
+
+Files and other data are encoded into the following primitive to be embedded in the page as images and files, which can be downloaded as attachments or displayed directly.
+
+```json
+{ "type": "OBJ", "id":"UUID", "ticket": 1 }||
+{
+  "partitionId":null,
+  "groupId":0,
+  "locked":1,
+  "zIndex":5.286,
+  "layerId":15,
+  "fileName":"a.png",
+  "startX":200,
+  "startY":300,
+  "width":10,
+  "height":20,
+  "angle":0,
+  "mirror":1,
+  "path":"blob:1234ade2f",
+}|
+["OBJ", "e662", 0, 1, 5.286, 15, "a.png", 200, 300, 10, 20, 0, 1, "blob:1234ade2f"]
+```
+
+1. type binary embedded object identifier: OBJ.
+2. id primitive ID, unique within the document.
+3. ticket logical clock.
+4. partitionId partition ID it belongs to, null means no partition. Ignored for footprints.
+5. groupId group ID: 0 no group, non-zero is the group flag, same flag means same group.
+6. locked whether locked.
+7. zIndex Z-axis height.
+8. layerId layer.
+9. fileName file name.
+10. startX top-left X.
+11. startY top-left Y.
+12. width width.
+13. height height.
+14. angle rotation angle, around `top-left`.
+15. mirror whether the original image is horizontally mirrored. Mirroring is performed around the center of the original image's BBox.
+16. path binary data.
+    1. General format, compatible with `Data URLs`: `data:[<mediatype>][;base64],<data>`
+        - e.g. `data:image/png;base64,asdfasdfwer`
+    2. BLOB reference format, `blob:hashid`.

package/skill/format/pcb/pad_via.md

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+# Pads and Vias
+
+## VIA Via
+
+Vias are generally used to connect circuits between different layers.
+For multi-layer boards, there are generally the following modes:
+Through-hole: from `start layer` to `end layer`, through top and bottom.
+Blind via: only one of `start layer` or `end layer` is top or bottom.
+Buried via: neither `start layer` nor `end layer` is top or bottom.
+
+```json
+{ "type": "VIA", "id":"UUID", "ticket": 1 }||
+{
+  "partitionId":null,
+  "groupId":0,
+  "locked":1,
+  "zIndex":3.223,
+  "netName":"GND",
+  "ruleName":"asdf",
+  "centerX":100,
+  "centerY":200,
+  "holeDiameter":5,
+  "viaDiameter":9,
+  "viaType":0,
+  "topSolderExpansion":null,
+  "bottomSolderExpansion":null,
+  "unusedInnerLayers":[17],
+}|
+```
+
+1. type via `VIA`.
+2. id primitive ID, unique within the document.
+3. ticket logical clock.
+4. partitionId partition ID it belongs to, null means no partition. Ignored for footprints.
+5. groupId group ID: 0 no group, non-zero is the group flag, same flag means same group.
+6. locked whether locked.
+7. zIndex Z-axis height.
+8. netName NET.
+9. ruleName via layer type: design rule name, defines start and end layers of the via.
+10. centerX coordinate X.
+11. centerY coordinate Y.
+12. holeDiameter hole diameter.
+13. viaDiameter pad diameter.
+14. viaType via type: 0 normal via, 1 stitching via.
+15. topSolderExpansion top solder mask expansion: `null` means follow rule.
+16. bottomSolderExpansion bottom solder mask expansion: `null` means follow rule.
+17. unusedInnerLayers hidden pad layers (optional): array of layers where pads are hidden.
+
+## PAD Pad
+
+Pads are generally used for soldering components to the circuit board.
+Pads either run through the entire board or only on the top or bottom layer, so there are only top, bottom, and multi-layer options.
+
+```json
+{ "type": "PAD", "id":"UUID", "ticket": 1 }||
+{
+  "partitionId":null,
+  "groupId":0,
+  "locked":1,
+  "zIndex":6.234,
+  "netName":"GND",
+  "layerId":0,
+  "num":"1",
+  "centerX":100,
+  "centerY":200,
+  "padAngle":15,
+  "hole":["reference hole"],
+  "defaultPad":["reference pad"],
+  "specialPad":[[0, 1, ["reference pad"]]],
+  "padOffsetX":10,
+  "padOffsetY":-5,
+  "relativeAngle":30,
+  "plated":1,
+  "padType":null,
+  "topSolderExpansion":0.5,
+  "bottomSolderExpansion":0.4,
+  "topPasteExpansion":null,
+  "bottomPasteExpansion":0,
+  "connectMode":0,
+  "spokeSpace":10,
+  "spokeWidth":5,
+  "spokeAngle":45,
+  "unusedInnerLayers":[15, 17],
+}|
+```
+
+1. type pad `PAD`.
+2. id primitive ID, unique within the document.
+3. ticket logical clock.
+4. partitionId partition ID it belongs to, null means no partition. Ignored for footprints.
+5. groupId group ID: 0 no group, non-zero is the group flag, same flag means same group.
+6. locked whether locked.
+7. zIndex Z-axis height.
+8. netName net.
+9. layerId layer (only top, bottom, multi-layer).
+10. num pad number.
+11. centerX pad origin X.
+12. centerY pad origin Y.
+13. padAngle pad rotation angle.
+14. hole hole: reference hole, `null` means no hole.
+15. defaultPad default pad: reference pad.
+16. specialPad special pads (multiple groups, each group defined as follows).
+    1. start layer.
+    2. end layer.
+    3. reference pad.
+17. padOffsetX hole offset X.
+18. padOffsetY hole offset Y.
+19. relativeAngle hole rotation relative to pad.
+20. plated whether plated hole wall.
+21. padType pad function: 0 normal pad, 1 test point, 2 fiducial.
+22. topSolderExpansion top solder mask expansion: `null` means follow rule.
+23. bottomSolderExpansion bottom solder mask expansion: `null` means follow rule.
+24. topPasteExpansion top paste mask expansion: `null` means follow rule.
+25. bottomPasteExpansion bottom paste mask expansion: `null` means follow rule.
+26. connectMode thermal relief - connection mode: `null` means follow rule, other data same as design rules.
+27. spokeSpace thermal relief - spoke spacing: `null` means follow rule, other data same as design rules.
+28. spokeWidth thermal relief - spoke width: `null` means follow rule, other data same as design rules.
+29. spokeAngle thermal relief - spoke angle: `null` means follow rule, other data same as design rules.
+30. unusedInnerLayers hidden pad layers (optional): array of layers where pads are hidden.
+
+### Hole
+
+1. Slot hole
+    1. Slot hole `ROUND`
+    2. width
+    3. height
+2. Square hole
+    1. Square hole `RECT`
+    2. width
+    3. height
+
+### Pad
+
+Hole rotation and pad rotation are independent.
+
+1. Oblong pad
+    1. Oblong pad `ROUND`
+    2. width
+    3. height
+2. Square pad
+    1. Square pad `RECT`
+    2. width
+    3. height
+    4. corner radius
+3. Regular polygon pad
+    1. Regular polygon pad `NGON` (name from 3DSMAX)
+    2. diameter
+    3. number of sides (> 2)
+4. Polygon pad
+    1. Polygon pad `POLY`
+    2. reference complex polygon, relative position to hole as origin

package/skill/format/pcb/panel.md

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+# Panelization
+
+```json
+{ "type": "PANELIZE", "ticket": 1 }||
+{
+  "on":1,
+  "row":2,
+  "column":3,
+  "rowSpacing":5.5,
+  "columnSpacing":6.1,
+  "onlyOutline":1,
+}|
+```
+
+1. type panelization `PANELIZE`.
+2. ticket logical clock.
+3. on whether enabled.
+4. row number of rows.
+5. column number of columns.
+6. rowSpacing row spacing.
+7. columnSpacing column spacing.
+8. onlyOutline whether to panelize outline only.
+
+```json
+{ "type": "PANELIZE_STAMP", "ticket": 1 }||
+{
+  "direction":1,
+  "on":1,
+  "stampHoleGroupQuantity":3,
+  "stampHoleDiameter":8,
+  "stampHoleQuantityPerGroup":0,
+  "stampHoleSpacing":1,
+}|
+```
+
+1. type stamp hole parameters: `PANELIZE_STAMP`.
+2. ticket logical clock.
+3. direction direction: `0` horizontal, `1` vertical.
+4. on whether enabled (if not enabled, V-CUT is used).
+5. stampHoleGroupQuantity number of stamp hole groups.
+6. stampHoleDiameter stamp hole diameter.
+7. stampHoleQuantityPerGroup number of stamp holes per group.
+8. stampHoleSpacing stamp hole spacing.
+
+```json
+{ "type": "PANELIZE_SIDE", "ticket": 1 }||
+{
+  "direction":0,
+  "on":1,
+  "sideHeight":5,
+  "positionHoleDiameter":3,
+  "markDiameter":2,
+  "markExpansion":1,
+}|
+```
+
+1. type process edge parameters: `PANELIZE_SIDE`.
+2. ticket logical clock.
+3. direction direction: `0` horizontal, `1` vertical.
+4. on whether enabled (if not enabled, process edge is not used).
+5. sideHeight process edge height.
+6. positionHoleDiameter positioning hole diameter (`0` means no positioning hole).
+7. markDiameter Mark dot diameter (`0` means Mark dot disabled).
+8. markExpansion Mark dot solder mask expansion.

package/skill/format/pcb/partition.md

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+# Partition Format
+
+PCB introduces partition design. Partition design needs to mark partition information for many elements, so the following format is used.
+
+## PARTITION Partition Primitive
+
+```json
+{ "type": "LAYER_PHYS","id": "UUID", "ticket": 1 }||
+{
+  "name":"Partition 1",
+  "fileUuid":"SUB-PCB-UUID",
+  "path":"complex polygon",
+}|
+```
+
+1. type partition: `PARTITION`.
+2. id primitive ID.
+3. ticket logical clock.
+4. name partition name.
+5. fileUuid child drawing UUID.
+6. path partition shape.
+
+All primitives belonging to a partition must carry the corresponding partition primitive ID.
+
+```json
+{ "type": "VIA", "id":"viaUuid", "ticket": 1 }||
+{
+  "partitionId":"partitionId",// carries this id to indicate belonging to the corresponding partition
+  "groupId":0,
+  "locked":1,
+  "zIndex":3.223,
+  "netName":"GND",
+  "ruleName":"asdf",
+  "centerX":100,
+  "centerY":200,
+  "holeDiameter":5,
+  "viaDiameter":9,
+  "viaType":0,
+  "topSolderExpansion":null,
+  "bottomSolderExpansion":null,
+  "unusedInnerLayers":[17],
+}|
+```