@itxtech/fdnext-resources 2.3.0

package/resources/lang/chs.json

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+{
+  "true": "是",
+  "false": "否",
+  "Unknown": "未知",
+  "unknown": "未知",
+  "memory": "存储器",
+  "power": "电源",
+  "intel": "英特尔",
+  "micron": "美光",
+  "samsung": "三星",
+  "siliconmotion": "慧荣",
+  "nanya": "南亚",
+  "elpida": "尔必达",
+  "issi": "ISSI",
+  "esmt": "晶豪科技",
+  "etron": "钰创",
+  "cxmt": "长鑫存储",
+  "westerndigital": "闪迪",
+  "sndk": "闪迪",
+  "kingston": "金士顿",
+  "longsys": "江波龙",
+  "biwin": "佰维",
+  "skhynix": "SK海力士",
+  "spectek": "美光降级",
+  "kioxia": "铠侠",
+  "phison": "群联",
+  "ymtc": "长江存储",
+  "st": "意法半导体",
+  "powerchip": "力晶",
+  "ato": "ATO",
+  "fidelix": "Fidelix",
+  "infineon": "英飞凌",
+  "memoright": "Memoright",
+  "mira": "Mira",
+  "mxic": "旺宏",
+  "pfc": "PFC",
+  "renesas": "瑞萨",
+  "smic": "中芯国际",
+  "spansion": "飞索",
+  "fujitsu": "富士通",
+  "qimonda": "奇梦达",
+  "winbond": "华邦",
+  "original_vendor": "原始厂商",
+  "vendor": "供应商",
+  "part_number": "料号",
+  "chip_kind": "芯片类型",
+  "product_type": "产品类型",
+  "identifier": "标识符",
+  "id_scheme": "标识符类型",
+  "nand": "NAND",
+  "raw_nand": "Raw NAND",
+  "managed_nand": "Managed NAND",
+  "ufs": "UFS",
+  "emmc": "eMMC",
+  "sata": "SATA",
+  "nvme": "NVMe",
+  "UFS": "UFS",
+  "eMMC": "eMMC",
+  "emcp": "eMCP",
+  "umcp": "uMCP",
+  "e2nand": "E2NAND",
+  "lpddr4": "LPDDR4",
+  "lpddr4x": "LPDDR4X",
+  "lpddr5": "LPDDR5",
+  "lpddr5x": "LPDDR5X",
+  "ddr3": "DDR3",
+  "ddr4": "DDR4",
+  "ddr5": "DDR5",
+  "nand.flash_id": "NAND Flash ID",
+  "dram": "DRAM",
+  "nor": "NOR",
+  "pmic": "PMIC",
+  "3dxpoint": "3D XPoint",
+  "sandisk_code": "code锁",
+  "skhynix_ot_c": "商用 (0~70C)",
+  "skhynix_ot_e": "扩展 (-25~85C)",
+  "skhynix_ot_m": "移动 (-30~85C)",
+  "skhynix_ot_i": "工业 (-40~85C)",
+  "spectek_density_grade_zero": "见S*定义（芯片上的SG，S7，S8字样)",
+  "spectek_pfpt_a": "所有片选可用",
+  "spectek_pfpt_b": "片选1可用，片选2不保证",
+  "spectek_pfpt_c": "片选2可用，片选1不保证",
+  "spectek_pfpt_d": "SLC可用，请联系工厂",
+  "samsung_none": "无",
+  "samsung_temp_c": "商用",
+  "samsung_temp_s": "SmartMedia",
+  "samsung_temp_b": "SmartMedia BLUE",
+  "samsung_temp_i": "工业",
+  "samsung_cbb_b": "包含坏块",
+  "samsung_cbb_k": "特殊处理",
+  "samsung_cbb_l": "1-5个坏块",
+  "samsung_cbb_n": "ini. 0 blk, add. 10 blk",
+  "samsung_cbb_s": "全是好块",
+  "intel_sku_s": "客户端",
+  "micron_p": "量产",
+  "die_code": "Die 代码",
+  "die_revision": "Die 版本",
+  "speed_grade": "速度等级",
+  "prod_status": "生产状态",
+  "prod_date": "生产日期",
+  "lead_free": "无铅",
+  "plane": "Plane",
+  "assembly": "装配",
+  "segment": "产品分段",
+  "halogen_free": "无卤",
+  "wafer": "晶圆",
+  "operation_temperature": "操作温度",
+  "product_family": "产品族",
+  "product_version": "产品版本",
+  "product_mode": "产品模式",
+  "product_class": "产品等级",
+  "product_generation": "产品代际",
+  "generation_info": "产品代际",
+  "managed_family": "Managed NAND 族",
+  "nand_technology": "NAND 技术",
+  "nand_component": "NAND 组件",
+  "component_width": "组件位宽",
+  "component_density": "组件容量",
+  "component_voltage": "组件电压",
+  "marking_code": "Marking 编码",
+  "density": "容量",
+  "sector_size": "扇区大小",
+  "storage_density": "存储容量",
+  "dram_density": "DRAM 容量",
+  "dram_type": "DRAM 类型",
+  "dram_die_density": "DRAM Die 容量",
+  "dram_die_stack": "DRAM Die 堆叠",
+  "dram_generation": "DRAM 代际",
+  "dram_speed": "DRAM 速度",
+  "cas_latency": "CAS 延迟",
+  "dram_width": "DRAM 位宽",
+  "dram_voltage": "DRAM 电压",
+  "storage_interface": "存储接口",
+  "controller_code": "控制器编码",
+  "controller_revision": "控制器版本",
+  "package_code": "封装编码",
+  "solder_type": "焊接类型",
+  "special_option": "特殊选项",
+  "feature_code": "特性编码",
+  "series_info": "系列",
+  "config_code": "配置编码",
+  "die_density": "Die 容量",
+  "die_codename": "制程",
+  "process_alias": "制程代号",
+  "die_stack": "Die 堆叠",
+  "die_count": "Die 数",
+  "ce_count": "CE 数",
+  "rb_count": "R/B 数",
+  "channel_count": "Channel 数",
+  "plane_count": "Plane 数",
+  "controller": "控制器",
+  "bad_block": "坏块",
+  "sku": "SKU",
+  "toggle": "Toggle DDR 版本",
+  "cu": "铜工艺",
+  "multi_chip": "多晶片",
+  "cell_level": "Cell 类型",
+  "process_node": "制程节点",
+  "layer_count": "堆叠层数",
+  "device_width": "器件位宽",
+  "voltage": "电压",
+  "package": "封装",
+  "Commercial": "商用",
+  "Client": "客户端",
+  "Client MLC": "客户端 MLC",
+  "Downgrade": "降级",
+  "Enterprise": "企业级",
+  "Low Speed": "低速",
+  "Undefined": "未定义",
+  "Fourth": "第四代",
+  "Wireless (-25°C ~ 85°C)": "无线温度范围 (-25°C ~ 85°C)",
+  "Rev B": "B 版",
+  "Rev 9": "9 版",
+  "4-die stack": "4 die 堆叠",
+  "ODP (8-die)": "ODP (8 die)",
+  "enterprise": "企业级",
+  "page_size": "页大小",
+  "block_size": "块大小",
+  "ecc_enabled": "ECC 已启用",
+  "half_page_and_size": "半页大小",
+  "package_functionality_partial_type": "封装可用部分类型",
+  "interface_type": "接口类型",
+  "density_grade": "可用容量",
+  "micron_part_number": "美光料号",
+  "micron_website": "美光官网",
+  "diffusion_loc": "生产位置",
+  "encapsulation_loc": "封装位置",
+  "cty_us": "美国",
+  "cty_sg": "新加坡",
+  "cty_it": "意大利",
+  "cty_jp": "日本",
+  "cty_cn": "中国",
+  "cty_tw": "中国台湾",
+  "cty_kr": "韩国",
+  "cty_mixed": "混合",
+  "cty_il": "以色列",
+  "cty_ie": "爱尔兰",
+  "cty_my": "马来西亚",
+  "cty_ph": "菲律宾",
+  "pages_per_block": "页/块",
+  "blocks_per_lun": "块/LUN",
+  "timing_mode_async": "异步定时模式",
+  "revision": "版本",
+  "interface": "接口",
+  "simultaneously_programmed_pages": "可同时编程页面数",
+  "interleave": "交错",
+  "cache": "缓存",
+  "redundant_area_size": "冗余区域大小",
+  "ecc_level": "ECC 要求",
+  "edo": "EDO",
+  "block.identity": "身份",
+  "block.storage": "存储",
+  "block.dram": "DRAM",
+  "block.geometry": "几何信息",
+  "block.package": "封装",
+  "block.interface": "接口",
+  "block.timing": "时序",
+  "block.marking": "Marking",
+  "block.components": "组件",
+  "block.controllers": "控制器",
+  "block.additional": "其他字段",
+  "action.part.decode": "解析料号",
+  "action.identifier.decode.nand_flash_id": "解析 NAND Flash ID",
+  "warning.empty_query": "料号查询为空",
+  "warning.invalid_nand_flash_id": "NAND Flash ID 必须是偶数长度的十六进制字节串",
+  "warning.invalid_nand_flash_id.search": "NAND Flash ID 搜索需要十六进制字节串",
+  "warning.unsupported_id_scheme": "不支持的标识符类型：{idScheme}",
+  "warning.constraint_mismatch.vendor": "供应商约束 {expected} 与实际 {actual} 不匹配",
+  "warning.constraint_mismatch.chip_kind": "芯片类型约束 {expected} 与实际 {actual} 不匹配",
+  "warning.constraint_mismatch.product_type": "产品类型约束 {expected} 与实际 {actual} 不匹配",
+  "warning.constraint_mismatch.strict": "没有料号候选匹配 strict 约束",
+  "warning.fdb_process_fallback": "未命中 die profile 规则，已使用 FDB 旧制程信息作为临时提示",
+  "warning.ambiguous_part": "多个料号候选匹配该查询",
+  "subtitle.kind.raw_nand": "NAND Flash",
+  "subtitle.kind.managed_nand": "Managed NAND",
+  "subtitle.kind.dram": "DRAM",
+  "subtitle.kind.memory": "Memory chip",
+  "subtitle.die_count": "{count} die",
+  "subtitle.plane_count": "{count} planes",
+  "controller_group.all.title": "全部主控",
+  "controller_group.all.description": "FDB 报告的完整主控清单。",
+  "controller_group.selected.title": "精选主控",
+  "controller_group.selected.description": "用于默认界面筛选和精简支持视图的精选主控集合。",
+  "controller_group.if:usb20.title": "USB 2.0",
+  "controller_group.if:usb20.description": "USB 2.0 闪存主控。",
+  "controller_group.if:usb32g1.title": "USB 3.2 Gen 1",
+  "controller_group.if:usb32g1.description": "5 Gbps USB 闪存主控。",
+  "controller_group.if:usb32g2.title": "USB 3.2 Gen 2",
+  "controller_group.if:usb32g2.description": "Gen 2/2x2 USB SSD 主控。",
+  "controller_group.if:sata.title": "SATA 主控",
+  "controller_group.if:sata.description": "采用 SATA 主机接口的 SSD 主控。",
+  "controller_group.if:nvme.title": "NVMe 主控",
+  "controller_group.if:nvme.description": "采用 PCIe/NVMe 主机接口的 SSD 主控。",
+  "controller_group.era:pre18.title": "2018 年前发布",
+  "controller_group.era:pre18.description": "2018 年前已发布或已存在的主控。",
+  "controller_group.era:plus18.title": "2018 年及以后发布",
+  "controller_group.era:plus18.description": "2018 年及以后发布的主控。"
+}

package/resources/lang/eng.json

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+{
+  "true": "Yes",
+  "false": "No",
+  "Unknown": "Unknown",
+  "unknown": "Unknown",
+  "memory": "Memory",
+  "power": "Power",
+  "intel": "Intel",
+  "micron": "Micron",
+  "samsung": "Samsung",
+  "siliconmotion": "Silicon Motion",
+  "nanya": "Nanya",
+  "elpida": "Elpida",
+  "issi": "ISSI",
+  "esmt": "ESMT",
+  "etron": "Etron",
+  "cxmt": "CXMT",
+  "westerndigital": "Sandisk",
+  "sndk": "Sandisk",
+  "kingston": "Kingston",
+  "longsys": "Longsys",
+  "biwin": "BIWIN",
+  "skhynix": "SKhynix",
+  "spectek": "SpecTek",
+  "kioxia": "Kioxia",
+  "ymtc": "YMTC",
+  "phison": "Phison",
+  "st": "ST",
+  "powerchip": "PowerChip",
+  "ato": "ATO",
+  "fidelix": "Fidelix",
+  "infineon": "Infineon",
+  "memoright": "Memoright",
+  "mira": "Mira",
+  "mxic": "Macronix",
+  "pfc": "PFC",
+  "renesas": "Renesas",
+  "smic": "SMIC",
+  "spansion": "Spansion",
+  "fujitsu": "Fujitsu",
+  "qimonda": "Qimonda",
+  "winbond": "Winbond",
+  "original_vendor": "Original Vendor",
+  "vendor": "Vendor",
+  "part_number": "Part Number",
+  "chip_kind": "Chip Kind",
+  "product_type": "Product Type",
+  "identifier": "Identifier",
+  "id_scheme": "Identifier Scheme",
+  "nand": "NAND",
+  "raw_nand": "Raw NAND",
+  "managed_nand": "Managed NAND",
+  "ufs": "UFS",
+  "emmc": "eMMC",
+  "sata": "SATA",
+  "nvme": "NVMe",
+  "UFS": "UFS",
+  "eMMC": "eMMC",
+  "emcp": "eMCP",
+  "umcp": "uMCP",
+  "e2nand": "E2NAND",
+  "lpddr4": "LPDDR4",
+  "lpddr4x": "LPDDR4X",
+  "lpddr5": "LPDDR5",
+  "lpddr5x": "LPDDR5X",
+  "ddr3": "DDR3",
+  "ddr4": "DDR4",
+  "ddr5": "DDR5",
+  "nand.flash_id": "NAND Flash ID",
+  "dram": "DRAM",
+  "nor": "NOR",
+  "pmic": "PMIC",
+  "3dxpoint": "3D XPoint",
+  "sandisk_code": "Code locked",
+  "skhynix_ot_c": "Commercial (0~70C)",
+  "skhynix_ot_e": "Extended (-25~85C)",
+  "skhynix_ot_m": "Mobile (-30~85C)",
+  "skhynix_ot_i": "Industrial (-40~85C)",
+  "spectek_density_grade_zero": "BL or S* grade definitions",
+  "spectek_pfpt_a": "All CE(s) are valid and usable",
+  "spectek_pfpt_b": "CE1 Valid, CE2 not guaranteed",
+  "spectek_pfpt_c": "CE2 Valid, CE1 not guaranteed",
+  "spectek_pfpt_d": "SLC on the fly. Consult factory for more information",
+  "samsung_none": "NONE",
+  "samsung_temp_c": "Commercial",
+  "samsung_temp_s": "SmartMedia",
+  "samsung_temp_b": "SmartMedia BLUE",
+  "samsung_temp_i": "Industrial",
+  "samsung_cbb_b": "Include Bad Block",
+  "samsung_cbb_k": "Special Handling",
+  "samsung_cbb_l": "1-5 Bad Block",
+  "samsung_cbb_n": "ini. 0 blk, add. 10 blk",
+  "samsung_cbb_s": "All Good Block",
+  "intel_sku_s": "Client",
+  "micron_p": "Production",
+  "die_code": "Die Code",
+  "die_revision": "Die Revision",
+  "speed_grade": "Speed Grade",
+  "prod_status": "Production Status",
+  "prod_date": "Production Date",
+  "lead_free": "Lead free",
+  "plane": "Plane",
+  "assembly": "Assembly",
+  "segment": "Segment",
+  "halogen_free": "Halogen free",
+  "wafer": "Wafer",
+  "operation_temperature": "Operation Temperature",
+  "product_family": "Product Family",
+  "product_version": "Product Version",
+  "product_mode": "Product Mode",
+  "product_class": "Product Class",
+  "product_generation": "Product Generation",
+  "generation_info": "Product Generation",
+  "managed_family": "Managed Family",
+  "nand_technology": "NAND Technology",
+  "nand_component": "NAND Component",
+  "component_width": "Component Width",
+  "component_density": "Component Density",
+  "component_voltage": "Component Voltage",
+  "marking_code": "Marking Code",
+  "density": "Density",
+  "sector_size": "Sector Size",
+  "storage_density": "Storage Density",
+  "dram_density": "DRAM Density",
+  "dram_type": "DRAM Type",
+  "dram_die_density": "DRAM Die Density",
+  "dram_die_stack": "DRAM Die Stack",
+  "dram_generation": "DRAM Generation",
+  "dram_speed": "DRAM Speed",
+  "cas_latency": "CAS Latency",
+  "dram_width": "DRAM Width",
+  "dram_voltage": "DRAM Voltage",
+  "storage_interface": "Storage Interface",
+  "controller_code": "Controller Code",
+  "controller_revision": "Controller Revision",
+  "package_code": "Package Code",
+  "solder_type": "Solder Type",
+  "special_option": "Special Option",
+  "feature_code": "Feature Code",
+  "series_info": "Series",
+  "config_code": "Config Code",
+  "die_density": "Die Density",
+  "die_codename": "Process",
+  "process_alias": "Process Alias",
+  "die_stack": "Die Stack",
+  "die_count": "Die Count",
+  "ce_count": "CE Count",
+  "rb_count": "R/B Count",
+  "channel_count": "Channel Count",
+  "plane_count": "Plane Count",
+  "controller": "Controller",
+  "bad_block": "Bad block",
+  "sku": "SKU",
+  "toggle": "Toggle DDR version",
+  "cu": "CU",
+  "multi_chip": "Multi chip",
+  "cell_level": "Cell Level",
+  "process_node": "Process Node",
+  "layer_count": "Layer Count",
+  "device_width": "Device Width",
+  "voltage": "Voltage",
+  "package": "Package",
+  "Commercial": "Commercial",
+  "Client": "Client",
+  "Client MLC": "Client MLC",
+  "Downgrade": "Downgrade",
+  "Enterprise": "Enterprise",
+  "Low Speed": "Low Speed",
+  "Undefined": "Undefined",
+  "enterprise": "Enterprise",
+  "Fourth": "Fourth",
+  "Wireless (-25°C ~ 85°C)": "Wireless (-25°C ~ 85°C)",
+  "Rev B": "Rev B",
+  "Rev 9": "Rev 9",
+  "4-die stack": "4-die stack",
+  "ODP (8-die)": "ODP (8-die)",
+  "page_size": "Page size",
+  "block_size": "Block size",
+  "ecc_enabled": "ECC enabled",
+  "half_page_and_size": "Half page and size",
+  "package_functionality_partial_type": "Package functionality partial type",
+  "interface_type": "Interface Type",
+  "density_grade": "Density grade",
+  "micron_part_number": "Micron Part Number",
+  "micron_website": "Micron Website",
+  "diffusion_loc": "Diffusion Location",
+  "encapsulation_loc": "Encapsulation Location",
+  "cty_us": "USA",
+  "cty_sg": "Singapore",
+  "cty_it": "Italy",
+  "cty_jp": "Japan",
+  "cty_cn": "China",
+  "cty_tw": "Taiwan (China)",
+  "cty_kr": "Korea",
+  "cty_mixed": "Mixed",
+  "cty_il": "Israel",
+  "cty_ie": "Ireland",
+  "cty_my": "Malaysia",
+  "cty_ph": "Philippines",
+  "pages_per_block": "Pages Per Block",
+  "blocks_per_lun": "Blocks per LUN",
+  "timing_mode_async": "Async Timing Mode",
+  "revision": "Revision",
+  "interface": "Interface",
+  "simultaneously_programmed_pages": "Simultaneously Programmed Pages",
+  "interleave": "Interleave",
+  "cache": "Cache",
+  "redundant_area_size": "Redundant Area Size",
+  "ecc_level": "ECC Level",
+  "edo": "EDO",
+  "block.identity": "Identity",
+  "block.storage": "Storage",
+  "block.dram": "DRAM",
+  "block.geometry": "Geometry",
+  "block.package": "Package",
+  "block.interface": "Interface",
+  "block.timing": "Timing",
+  "block.marking": "Marking",
+  "block.components": "Components",
+  "block.controllers": "Controllers",
+  "block.additional": "Additional Fields",
+  "action.part.decode": "Decode Part",
+  "action.identifier.decode.nand_flash_id": "Decode NAND Flash ID",
+  "warning.empty_query": "Part query is empty",
+  "warning.invalid_nand_flash_id": "NAND Flash ID must be an even-length hexadecimal byte string",
+  "warning.invalid_nand_flash_id.search": "NAND Flash ID search requires a hexadecimal byte string",
+  "warning.unsupported_id_scheme": "Unsupported identifier scheme: {idScheme}",
+  "warning.constraint_mismatch.vendor": "Vendor constraint {expected} does not match {actual}",
+  "warning.constraint_mismatch.chip_kind": "Chip kind constraint {expected} does not match {actual}",
+  "warning.constraint_mismatch.product_type": "Product type constraint {expected} does not match {actual}",
+  "warning.constraint_mismatch.strict": "No part candidate matched the requested strict constraints",
+  "warning.fdb_process_fallback": "Using legacy FDB process information because no die profile rule matched",
+  "warning.ambiguous_part": "Multiple part candidates matched the query",
+  "subtitle.kind.raw_nand": "NAND Flash",
+  "subtitle.kind.managed_nand": "Managed NAND",
+  "subtitle.kind.dram": "DRAM",
+  "subtitle.kind.memory": "Memory chip",
+  "subtitle.die_count": "{count} die",
+  "subtitle.plane_count": "{count} planes",
+  "controller_group.all.title": "All controllers",
+  "controller_group.all.description": "Complete controller inventory reported by the bundled FDB.",
+  "controller_group.selected.title": "Selected controllers",
+  "controller_group.selected.description": "Curated controller set for default UI filters and compact support views.",
+  "controller_group.if:usb20.title": "USB 2.0",
+  "controller_group.if:usb20.description": "USB 2.0 flash controllers.",
+  "controller_group.if:usb32g1.title": "USB 3.2 Gen 1",
+  "controller_group.if:usb32g1.description": "5 Gbps USB flash controllers.",
+  "controller_group.if:usb32g2.title": "USB 3.2 Gen 2",
+  "controller_group.if:usb32g2.description": "Gen 2/2x2 USB SSD controllers.",
+  "controller_group.if:sata.title": "SATA controllers",
+  "controller_group.if:sata.description": "SSD controllers with a SATA host interface.",
+  "controller_group.if:nvme.title": "NVMe controllers",
+  "controller_group.if:nvme.description": "SSD controllers with a PCIe/NVMe host interface.",
+  "controller_group.era:pre18.title": "Before 2018",
+  "controller_group.era:pre18.description": "Controllers first released or already present before 2018.",
+  "controller_group.era:plus18.title": "2018 and later",
+  "controller_group.era:plus18.description": "Controllers released in 2018 or later."
+}